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An introduction of high-precise 3D measurement system and its applications

Hashimoto T., Kaneko M., Rövid A., Isono S., Sone T., Baba K., Fukuda A., Aniya M., Naito N., Enomoto H., Skvarca P.

Journal of Automation Mobile Robotics and Intelligent Systems

2009

Vol. 3, No. 4

25-28

We have been studying the high-precision three-dimensional measurement system using cameras. In this paper, our system is verified, and its application is reported. The principle of our measurement system is based on the stereo measurement. In our system, reducing the quantization error by numerical processing can realize the highprecision 3D measurement at the long distance. This measurement system has many applications, such as industrial use, ITS, robotics, and many others. Our system has been applied on the observation of the glacier. The Perito Moreno glacier, which is our target, moves very fast and the moving speed is reported as about 2 m/day. Then, it is thought that the important information about the global warming can be obtained by observing this glacier. But, as the width of the glacier is several km, there were no reports of continuously observing the movement of the glacier in high accuracy. As a result, the unique observation results about the daily movement of the glacier were measured. The observation of the glacier flow was carried out for the third straight year. In this paper, the valuable results of the glacier observation and experimental results to verify the precision are discussed.

Low-cost 320 x 240 uncooled IRFPA using conventional silicon IC process

Ishikawa T., Ueno M., Endo K., Nakaki Y., Hata H., Sone T., Kimata M.

Opto-Electronics Review

1999

Vol. 7, No. 4

297-303

A 320 x 240 uncooled infrared focal plane array (IRFPA) with series PN junction diodes fabricated on a silicon-on-insulator (SOI) wafer has been developed. Resistive bolometers, pyroelectric detectors and thermopile detectors have been reported for large scale uncooled IRFPAs, while the detector developed uses the temperature dependence of forward-biased voltage of the diode. The diode has low 1/f noise because it is fabricated on the monocrystalline SOI film which has few defects. The diode is supported by buried silicon dioxide (BOX) film of the SOI wafer, which becomes a part of a thermal isolated structure by using bulk silicon micromachining technique. The detector constains an absorbing membrane with a high fill factor of 90% to achieve high IR absorption, and the readout circuit of the FPA constains a gate modulation integrator to suppress the noise. Low cost IRFPA can be supplied because the whole structure of the FPA is fabricated on commercial SOI wafers using a conventional silicon IC process.

PtSi Schottky-barrier infrared focal plane arrays

Kimata M., Ueno M., Yagi H., Shiraishi T., Kawai M., Endo K., Kosasayama Y., Sone T., Ozeki T., Tsubouchi N.

Opto-Electronics Review

1998

Vol. 6, No. 1

1-10

The focal plane array (FPA) technology based on the PtSi Schottky-barrier (SB) photoemissive detector is presented. Taking advantage of Si-compatible manufacturing processes and high responsivity uniformity, we have developed a series of 2-dimensional PtSi SB FPAs with array sizes from 256 x 256 to 1040 x 1040 elements for medium wavelength thermal imaging, and two spaceborne long linear FPAs with 4096-element x 4-band and 2100-element x 6-band for short wavelength remote sensing applications. Along with design and performance of the FPAs, this paper reports on the Charge Sweep Device readout architecture, which is a key technology for high performance 2-D FPAs. A high reliability and high planarity packaging technology for large FPAs is also described.