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A new environmentally friendly chemical mechanical polishing method applied for surface finishing Ti-6Al-4V alloy

Quang Nguyen Minh, Quan Nguyen Ngoc, Mai Nguyen Trong, Thanh Le Thi Phuong, Tung Nguyen Tien, Tan Tran Ngoc, Hai Ha Thanh, Trinh Nguyen Duy

Journal of Machine Engineering

2023

Vol. 23, No. 4

64--76

A new eco-friendly slurry has been developed for the chemical mechanical polishing process with a solution of malic acid, deionized water, and an oxidizing agent hydrogen peroxide (H2O2). The surface quality of Ti-6Al-4V workpieces with the proposed chemical mechanical polishing slurry with optimal parameters include oxidizers (H2O2), colloidal (SiO2) slurry, and deionized water by weight 8%, 45%, and 47% respectively, the pH concentration is adjusted 4 through the malic acid content present in the slurry. Experimental results obtained with the proposed chemical mechanical polishing method show a more improved surface quality than previous studies when applying for polishing Ti-6Al-4V alloy. The developed chemical mechanical polishing method's polishing results under optimal conditions obtain an ultra-fine surface quality with Ra = 0.696 nm over a measuring area of 53×70 μm2. X-ray photoelectron (XPS) and electrochemical measurements were used to study the chemical reaction mechanisms in the proposed chemical mechanical polishing process. The chemical mechanical polishing processes for the surface of the Ti-6Al-4V alloy workpiece with the H2O2 oxidizing agent showed high suitability with the reactants formed on the surface such as Ti, V, and Al oxide. With the proposed oxidant and the established chemical mechanical polishing slurry, the feasibility and surface quality of the super smooth Ti-6Al-4V workpiece formed after polishing were demonstrated. The established chemical mechanical polishing method shows high applicability in environmental protection and Ti-6Al-4V alloy ultra-precision machining industries.

A new chemical mechanical slurry for polishing yttrium aluminium garnet material with magnesium oxide, sodium metasilicate pentahydrate and zirconium dioxide abrasive particles

Duc Le Anh, Hieu Pham Minh, Quang Nguyen Minh

Journal of Machine Engineering

2023

Vol. 23, No. 2

174--185

This work provided a new chemical-mechanical polishing mixture with MgO, sodium metasilicate pentahydrate, ZrO2 abrasive particles, and deionized water. With chemical-mechanical slurry (CMS) proposed for polishing yttrium aluminum oxide (Y3Al5O12) the surface reaction layer formed with significantly reduced hardness compared to other Y3Al5O12 materials, these products combine with MgO to form montmorillonites (3MgO–Al2O3–3SiO2–3Y2O3–5Al2O3). With this formation, the surface layer of Y3Al5O12 material becomes soft and is easily removed by ZrO2 abrasive particles under the influence of mechanical polishing, resulting in superfine surfaces generated from the proposed CMS model. The experimental results show that the surface quality with CMS proposed gives the surface quality with Ra = 0.471 nm along with the material removal rate 31 (nm/min). Surface quality is improved by 71% along with a superior material removal rate (increased by 287%) compared to silica slurry. The results show excellent polishing ability from CMS proposed for polishing Y3Al5O12 materials.

Polishing of poly(methyl methacrylate), polycarbonate, and SU-8 polymers

Zhong Z. W., Wang Z. F., Zirajutheen B. M. P., Tan Y. S., Tan Y. H.

Materials Science Poland

2007

Vol. 25, No. 1

103--112

Polymers such as poly(methyl methacrylate), polycarbonate, and SU-8 epoxy resin replace silicon as the major substrate in microfluidic system (or BioMEMS) fabrication. Chemical-mechanical polishing is an important technology for many advanced microelectromechanical systems (MEMS) and microoptoelectromechanical system applications. In this study, the chemical-mechanical polishing of polycarbonate, poly(methyl methacrylate), and SU-8 polymers was investigated. Four types of slurry were tested for chemical-mechanical polishing of polycarbonate and poly(methyl methacrylate). Experiments were then designed and performed to investigate the effects of two key process parameters. Experimental results show that an increase in head load or table speed causes an increase in material removal rates. Within the chosen experimental parameter ranges, the variation of table speed introduced a more significant change in material removal rates than that of head load. An analysis of variance was also carried out, and it was found that the interaction of head load and table speed had a significant effect (95% confidence) on the surface finish of polished poly(methyl methacrylate) samples, while table speed had a significant effect on the surface finish of polished polycarbonate samples. Chemical-mechanical polishing is also a process well suited for polishing SU-8 structures with high aspect ratios. Polished polycarbonate, poly(methyl methacrylate), and SU-8 surfaces had nanometer-order surface roughness, acceptable for most MEMS applications.