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Die Attachment Method on a Cu Finish by Pressure-Assisted Sinter Bonding in Air Using Cu Formate Paste

Jo Kyeong Hwan, Lee Jong-Hyun

Archives of Metallurgy and Materials

2020

Vol. 65, iss. 3

1057--1061

A paste containing Cu(II) formate rods was prepared, and characteristics of sinter bonding at 250°C under a pressure of 10 MPa were investigated to accomplish a high-speed die attachment for wide-bandgap power chips on Cu finish in air. Synthesisn of the plate-type Cu formate particles from CuO was accomplished through a wet reaction for 180 min. Cu, formed in situ in the bondline by pyrolysis of the formate during heating for the attachment, was sufficiently active to lead high-speed sintering within a carbon dioxide-hydrogen atmosphere derived from the pyrolysis, and the oxide layer on the Cu finish was reduced by the hydrogen. As a result, sinter bonding for 10 min formed a robust bonding with a shear strength approaching 27 MPa.