Wyniki wyszukiwania - BazTech

Ograniczanie wyników

1 Archives of Metallurgy and Materials

1 2021

Znaleziono wyników: 1

Liczba wyników na stronie

Wyniki wyszukiwania

Wyszukiwano:
w słowach kluczowych: µCP

Sortuj według:

Ogranicz wyniki do:

Selective Cu Electrodeposition on Micrometer Trenches Using Microcontact Printing and Additives

Shim Jinyong, Lee Jinhyun, Yoo Bongyoung

Archives of Metallurgy and Materials

2021

Vol. 66, iss. 3

741--744

Selective deposition was performed on a micrometer trench pattern using a microcontact printing (μCP) process. Alkanethiols required for selective deposition were analyzed according to the carbon chain by linear sweep voltammetry (LSV). According to the LSV analysis, the effect of inhibiting Cu deposition depending on the length of the carbon chain was observed. During the Cu electrodeposition, the trench could be filled without voids by additives (PEG, SPS, JGB) in the plating solution. A μCP process suppressing the deposition of the sample was used for selective Cu electrodeposition. However, there was oxidation and instability of the sample and 1-hexadecanethiol in air. To overcome these problems, the μCP method was performed in a glove box to achieve effective inhibition.