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Variability of the local phi MS values over the gate area of MOS devices

Przewłocki H. M., Kudła A., Brzezińska D., Massoud H. Z.

Journal of Telecommunications and Information Technology

2005

nr 1

34-44

The local value distributions of the effective contact potential difference (ECPD or the phi MS factor) over the gate area of Al-SiO2-Si structures were investigated for the first time. A modification of the photoelectric phi MS measurement method was developed, which allows determination of local values of this parameter in different parts of metaloxide-semiconductor (MOS) structures. It was found that the phi MS distribution was such, that its values were highest far away from the gate edge regions (e.g., in the middle of a square gate), lower in the vicinity of gate edges and still lower in the vicinity of gate corners. These results were confirmed by several independent photoelectric and electrical measurement methods. A model is proposed of this distribution in which the experimentally determined phi MS (x; y) distributions, found previously, are attributed to mechanical stress distributions in MOS structures. Model equations are derived and used to calculate phi MS (x; y) distributions for various structures. Results of these calculations remain in agreement with experimentally obtained distributions. Comparison of various characteristics calculated using the model with the results of photoelectric and electrical measurements of a wide range of Al-SiO2-Si structures support the validity of the model.

The lateral distribution of the effective contact potential difference over the gate area of MOS structures

Przewłocki H. M., Kudła I., Brzezińska D., Borowicz L., Sawicki Z., Massoud H. Z.

Electron Technology : Internet Journal

2003

Vol. 35, nr 6

1-6

The lateral distribution of the effective contact potential difference (ECPD), often referred to as the work-function difference φMS, was determined experimentally for the first time over the gate area of a metal-oxide-semiconductor (MOS) structure. The photoelectric method for measuring φMS in MOS devices was modified to characterize the lateral distribution of ECPD. In square MOS gates, it is found that φMS values were highest in the center area of the gate, lower along the gate edges, and lowest at the gate corners. These results were confirmed by several independent photoelectric and electrical measurement methods. A model is proposed, in which the experimentally determined φ(x,y) distributions, are attributed to mechanical stress distribtitions in MOS structures. Equations are derived allowing calculation of φMS(x,y) distributions for various structures. Results of these calculations remain in agreement with experimentally obtained distributions.