Copper thin films have been deposited onto Corning glass substrates by means of two kinds of DC magnetron sputtering. The goal of this research was to study differences in thermal characteristics of both kinds of the films. The differences between these layers originate from the technological processes; one of them employs an inert gas -- argon -- in the vacuum chamber, and the other is the so-called "pure" self-sputtering. Thermal characterization of the layers was performed using the scanning thermal microscopy (SThM) as well as a far field thermographical system.
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