Macroscopic response and decohesion models of metal-polymer laminates

• Autorzy: Bolzon G. , Shahmardani M.
• Języki publikacji: EN

Abstrakty

EN

Metal-polymer laminates are used in several technological fields, with applications ranging from flexible electronics to food packaging and lightweight components for transportation sectors. Models of different complexity have been proposed to evaluate the overall performances of these materials. Models are also used to recover the adhesion properties of the plies, which are difficult to be characterized otherwise. The overall material responses resulting from different constitutive assumptions are examined in this paper.

Słowa kluczowe

EN

metal foils; polymers; laminates; adhesion; failure

• Wydawca: Instytut Podstawowych Problemów Techniki PAN
• Czasopismo: Engineering Transactions
• Rocznik: 2017
• Tom: Vol. 65, iss. 1
• Strony: 53--59
• Opis fizyczny: Bibliogr. 10 poz., rys., tab., wykr.

Twórcy

autor

Bolzon G.

• Department of Civil and Environmental Engineering Politecnico di Milano piazza Leonardo da Vinci 32, 20133 Milano, Italy

autor

Shahmardani M.

• Department of Civil and Environmental Engineering Politecnico di Milano piazza Leonardo da Vinci 32, 20133 Milano, Italy

Bibliografia

• 1. Wong W.S., Salleo A. (Eds.), Flexible electronics. Materials and applications, Springer, New York, 2009.
• 2. Bolzon G., Cornaggia G., Shahmardani M., Giampieri A., Mameli A., Aluminum laminates in beverage packaging: models and experiences, Beverages, 1(3): 183–193, 2015, doi: 10.3390/beverages1030183.
• 3. Andreasson E., Kao-Walter S., St˚ahle P., Micro-mechanisms of a laminated packaging material during fracture, Engineering Fracture Mechanics, 127: 313–326, 2014, doi: 10.1016/j.engfracmech.2014.04.017.
• 4. Grujicic M., Sellappan V., Omar M.A., Seyr N., Obieglo A., Erdmann M., Holzleitner J., An overview of the polymer-to-metal direct-adhesion hybrid technologies for load-bearing automotive components, Journal of Materials Processing Technology, 197(1– 3): 363–373, 2008, doi: 10.1016/j.jmatprotec.2007.06.058.
• 5. Li T., Huang Z.Y., Xi Z.C., Lacour S.P., Wagner S., Suo Z., Delocalizing strain in a thin metal film on a polymer substrate, Mechanics of Materials, 37(2–3): 261–273, 2005, doi: 10.1016/j.mechmat.2004.02.002.
• 6. Li T., Suo Z., Ductility of thin metal films on polymer substrates modulated by interfacial adhesion, International Journal of Solids and Structures, 44(6): 1696–1705, 2007, doi: 10.1016/j.ijsolstr.2006.07.022.
• 7. Xu W., Lu T.J., Wang F., Effects of interfacial properties on the ductility of polymersupported metal films for flexible electronics, International Journal of Solids and Structures, 47(14–15): 1830–1837, 2010, doi: 10.1016/j.ijsolstr.2010.03.017.
• 8. Lu N., Suo Z., Vlassak J.J., The effect of film thickness on the failure strain of polymer supported metal films, Acta Materialia, 58(5): 1679–1687, 2010, doi: 10.1016/j.actamat.2009.11.010.
• 9. Mróz Z., Mróz K.P., Analysis of delamination and damage growth in joined bilayer systems, Geomechanics for Energy and the Environment, 4: 4–28, 2015, doi: 10.1016/j.gete.2015.10.001.
• 10. Abaqus/Explicit, Release 6.13-1, Dassault Systems Simulia Corp., Providence, RI, USA, 2013.

Uwagi

Opracowanie ze środków MNiSW w ramach umowy 812/P-DUN/2016 na działalność upowszechniającą naukę (zadania 2017).