Overview of AOI use in surface-mount technology control

• Autorzy: Michalska Magdalena

Identyfikatory

DOI

10.35784/iapgos.2379

Warianty tytułu

PL

Przegląd wykorzystania AOI w procesie kontroli montażu powierzchniowego

• Języki publikacji: EN

Abstrakty

EN

Surface-mount technology is now widely used in the production of printed circuit boards in the electronics industryand hasgained many supporters.The miniaturization of electronic components has forced the introduction of machines for visual inspection of assembly correctness, whichismore accurate and faster than the human eye, magnifier or microscope.Automatic Optical Inspection (AOI) is a control process that detects defectsand errors in the initial PCB manufacturing process.It has become an indispensable element of contract assembly, increasing the quality of services offered and production efficiency.It uses new designs of measuring heads, miniaturization of equipment, software processing the obtained imagesof boards, and complicated image transformation algorithms.

PL

Technologia montażu powierzchniowego jest obecnie szeroko stosowana w produkcji zespołów obwodów drukowanych w przemyśle elektronicznym. Zyskała ona bardzo wielu zwolenników. Miniaturyzacja komponentów elektronicznych wymusiła wprowadzenie maszynwizualnej kontroli poprawności montażu, bardziej dokładnych i szybszych niż ludzkie oko, lupa czy mikroskop. Automatyczna Inspekcja Optyczna (AOI) to proces kontroli wykrywania wad i błędów w początkowym procesie produkcji obwodów drukowanych. Staje się nieodzownym elementem montażu kontraktowego, wpływając na zwiększenie jakości oferowanych usług i efektywności produkcji. Wykorzystywane są w niej nowe konstrukcje głowic pomiarowych, miniaturyzacja sprzętu, oprogramowanie przetwarzące otrzymane obrazy płytek, skomplikowane algorytmy przekształcania obrazu.

Słowa kluczowe

EN

Automatic Optical Inspection; defect inspection; solder joints; surface-mount technology

PL

Automatyczna kontrola optyczna; kontrola defektów; połączenia lutowane; technologia montażu powierzchniowego

• Wydawca: Wydawnictwo Politechniki Lubelskiej
• Czasopismo: Informatyka, Automatyka, Pomiary w Gospodarce i Ochronie Środowiska
• Rocznik: 2020
• Tom: T. 10, nr 4
• Strony: 61--64
• Opis fizyczny: Bibliogr. 34 poz., rys., wykr.

Twórcy

autor

Michalska Magdalena

• Lublin University of Technology, Department of Electronics and Information Technology, Lublin, Poland

Bibliografia

• [1] Celik T., Tjahjadi T.: Contextual and variational contrast enhancement. IEEE Transactions on Image Processing 20(12), 2011, 3431–3441.
• [2] Chang C. C., Lin C. J.: LIBSVM: A library for support vector machines. ACM Transactions on Intelligent Systems and Technology 2(3), 2011, 1–27.
• [3] Chang K. H.: Development of optical inspection system for surface mount device light emitting diodes – master thesis. National Sun Yat-sen University, Taiwan 2012.
• [4] Chang W., Su C., Guo D.: Automated optical inspection for the runout tolerance of circular saw blades. Int. J. Adv. Manuf. Technol. 66, 2013, 565–582.
• [5] Colledani M., Tolio T.: Impact of Quality Control on Production System Performance. CIRP Annals - Manufacturing Technology 55(1), 2006, 453–456, [http://doi.org/10.1016/S0007-8506(07)60457-0].
• [6] Dar M., Newman K. E., Vachtsevanos G.: On-line inspection of surface mount devices using vision and infrared sensors. Conference Record Autotestcon’95. Systems Readiness: Test Technology for the 21st Century 1995, 376–384, [http://doi.org/10.1109/AUTEST.1995.522699].
• [7] Demir D., Birecik S., Kurugollu F., Sezgin M., Bucak I.O., Sankur B., Anarim E.: Quality inspection in PCBs and SMDs using computer vision techniques. 20th Annual Conference of IEEE Industrial Electronics 1994, 857–861 [http://doi.org/10.1109/IECON.1994.397899].
• [8] Fang Y. C., Tzeng Y. F., Wu K. Y.: A study of integrated optical design and optimization for LED backlight module with prism patterns. Journal of Display Technology 10(10), 2014, 812–818.
• [9] Gao H., Jin W., Yang X., Kaynak O.: A Line-Based-Clustering Approach for Ball Grid Array Component Inspection in Surface-Mount Technology. IEEE Transactions on Industrial Electronics 64(4), 2017, 3030–3038.
• [10] Garakani A., Michael D. J., Koljonen J.: Automated optical inspection apparatus. US Patent 5, 640, 199, 1997.
• [11] http://www.surfacemountprocess.com/#Circuit layout
• [12] https://www.cherbsloeh.pl/attachments/category/327/Brochure-K3D-Series_EN_Rev06-2017-12.pdf
• [13] Inman R. R., Blumenfeld D. E., Huang N., Li J.: Designing production systems for quality: Research opportunities from an automotive industry perspective. International Journal of Production Research 41(9), 2003, 1953–1971 [http://doi.org/10.1080/0020754031000077293].
• [14] Juha M.: X-ray Machine Vision for Circuit Board Inspection. Conf. of SME, Proc. Vision 86, 1986, 341–355.
• [15] Kim S. E., Jeon J. J., Eom I. K.: Image contrast enhancement using entropy scaling in wavelet domain. Signal Processing 127, 2016, 1–11.
• [16] Kuo C. F. J., Hsu C. T. M., Liu Z. X., Wu H. C.: Automatic inspection system of LED chip using two-stages back-propagation neural network. Journal of Intelligent Manufacturing 25(6), 2015, 1235–1243.
• [17] Kuo C. J., Fang T., Lee C.: Automated optical inspection system for surface mount device light emitting diodes. J. Intell. Manuf. 30, 2019, 641–655.
• [18] Kuo C. J., Tung C., Weng W: Applying the support vector machine with optimal parameter design into an automatic inspection system for classifying micro-defects on surfaces of light-emitting diode chips. J. Intell. Manuf. 30, 2019, 727–741 [http://doi.org/https://doi.org/10.1007/s10845-016-1275-1].
• [19] Langley F. J., Boatright R. R., Crosby L.: Composite electro-optical testing of surface-mount device boards-one manufacturer’s experience, Proceedings: Meeting the Tests of Time, International Test Conference 1989, 686–691 [http://doi.org/10.1109/TEST.1989.82356].
• [20] Li Q., Ren S.: A visual detection system for rail surface defects. IEEE Transactions on Systems Man and Cybernetics Part C-Applications and Review 42(6), 2012, 1531–1542.
• [21] Li Q., Ren S.: A visual detection system for rail surface defects. IEEE Transactions on Systems Man and Cybernetics Part C-Applications and Review, 42(6), 2012, 1531–1542.
• [22] Lin, H. D.: Automated defect inspection of light-emitting diode chips using neural network and statistical approaches. Expert Systems With Applications 36(1), 2009, 219–226.
• [23] Ling‐Yau C., Lawrence Wing‐Tung L.: Total quality control for a surface mount technology process for the manufacture of printed circuit board assemblies, Quality and Reliability Engineering International 11(5), 1995, 325–331 [https://doi.org/10.1002/qre.4680110503].
• [24] Lu S., Zhang X., Kuang Y.: Optimal illuminator design for automatic optical inspection systems. International Journal of Computer Applications in Technology 37(2), 2010.
• [25] Mahon J., Harris N., Vernon D.: Automated visual inspection of solder paste deposition on surface mount technology PCBs. Elsevier – Computers in Industry, 1989.
• [26] Nandi G., Datta S., Bandyopadhyay A., Pal P.K.: Application of PCA-based hybrid Taguchi method for correlated multicriteria optimization of submerged arc weld: A case study. International Journal of Advanced Manufacturing Technology 45(3–4), 2009, 276–286.
• [27] Pang G. K. H, Chu M.: Automated optical inspection of solder paste based on 2.5D visual images. 2009 International Conference on Mechatronics and Automation, Changchun, 2009, 982–987 [http://doi.org/10.1109/ICMA.2009.5246351].
• [28] Perng D. B., Liu H. W., Chen S. H.: A vision-based LED defect auto-recognition system. Nondestructive Testing and Evaluation 29(4), 2014, 315–331.
• [29] Savage R. M., Park H. S., Fan M. S.: Automated inspection of solder joints for surface mount technology. NASA Technical Memorandum 104580, 1993 [http://doi.org/https://ntrs.nasa.gov/citations/19930016948].
• [30] Tsai D. M., Huang T. Y.: Automated surface inspection for statistical textures. Image and Vision Computing 21(4), 2003, 307–323.
• [31] Vanzetti R., Traub A. C.: Combining Soldering with Inspection. IEEE Control Systems Magazine 8(5), 1988, 29–32.
• [32] Watanabe Y.: Automated optical inspection of surface mount components using 2D machine vision. 15th Annual Conference of IEEE Industrial Electronics 3, 1989, 584–589 [http://doi.org/10.1109/IECON.1989.69697].
• [33] Wu H. H., Zhang X. M., Kuang Y. C., Lu S. L.: A real-time machine vision system for solder paste inspection. Proceeding of the 2008 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, 205–210.
• [34] Zhao H., Cheng J., Jin J.: NI vision based automatic optical inspection (AOI) for surface mount devices. Devices and method – 2009 International Conference on Applied Superconductivity and Electromagnetic Devices, 356–360 [http://doi.org/10.1109/ASEMD.2009.5306622].

Uwagi

Opracowanie rekordu ze środków MNiSW, umowa Nr 461252 w ramach programu "Społeczna odpowiedzialność nauki" - moduł: Popularyzacja nauki i promocja sportu (2021).