W ramach niniejszej pracy opanowano i opisano technologię wytwarzania nowych kompozycji epoksydowych zawierających w swym składzie związki metaloorganiczne podwyższające odporność na destrukcję w obecności tlenu oraz działające przeciwpleśniowo. Materiał badawczy w postaci płaskich próbek poddano działaniu agresywnego klimatu i określono zmiany właściwości elektrycznych oraz zmiany masy.
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The paper discusses plastics used in electronics and telecommunications, paying particular attention to epoxide materials and compounds, their composition and preparation. It presents issues concerning polymer aging caused by various environmental factors. As part hereof, a technology of production of new epoxide compounds containing organometallic compounds has been mastered and described. Flat samples of the research material were subjected to aggressive climate and changes and electrical properties were measured.
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The present study concerns numerical simulations and experimental measurements on the influence of inlet gas mass flow rate on the growth rate of aluminum nitride crystals in Metalorganic Vapor Phase Epitaxy reactor model AIX-200/4RF-S. The aim of this study was to design the optimal process conditions for obtaining the most homogeneous product. Since there are many agents influencing reactions relating to crystal growth such as temperature, pressure, gas composition and reactor geometry, it is difficult to design an optimal process. Variations of process pressure and hydrogen mass flow rates have been considered. Since it is impossible to experimentally determine the exact distribution of heat and mass transfer inside the reactor during crystal growth, detailed 3D modeling has been used to gain insight into the process conditions. Numerical simulations increase the understanding of the epitaxial process by calculating heat and mass transfer distribution during the growth of aluminum nitride crystals. Including chemical reactions in the numerical model enables the growth rate of the substrate to be calculated. The present approach has been applied to optimize homogeneity of AlN film thickness and its growth rate.
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