The electrical resistivity and the tensile strength of two near ternary eutectic Sn-Ag-Cu and four solder alloys close to ternary eutectic Sn-Ag-Cu with different Bi content as well as eight Sn- Ag-Cu-Bi with different Sb content in the form of wires were investigated. The four-probe technique was used for electrical parameters measurements. Equipment of the author’s own construction for the tensile strength measurement was applied. It was found that the additions of Bi and Sb to Sn-Ag-Cu near eutectic alloys increase the resistivity and the tensile strength and that the reistivity of the Sn-Ag-Cu-Bi and Sn-Ag-Cu-Bi-Sb alloys is comparable with those of Pb-Sn solders for the bismuth and antimony content of about 3 atomic percent.
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