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2 Opto-Electronics Review

2 2010

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320x256 HgCdTe IR FPA with a built-in shortwave cut-off filter

100%

Vasilyev V. V. , Varavin V. S. , Dvoretsky S. A. , Marchishin I. V. , Mikhailov N. N. , Predein A. V. , Remesnik V. G. , Sabinina I. V. , Sidorov Y. G. , Susliakov O. A.

tom Vol. 18, No. 3

236-240

A photovoltaic detector design based on the graded band gap HgCdTe MBE structure with high conductivity layer (HCL) at interface, which provides photodiodes series resistance and a shortwave cut.off filter is developed. The optimal HCL parameters giving high quantum efficiency and minimal noise equivalent temperature difference were determined by calculations and experimentally confirmed. The hybrid 320x256 IR FPA operating in 8-12 μm spectral range was fabricated. The threshold power responsivity and minimal noise equivalent temperature difference values at wavelength maximum were 1.02x10⁻⁷ W/cm², 4.1x10⁸ V/W and 27 mK, respectively.

Linear HgCdTe IR FPA 288 × 4 with bidirectional scanning

80%

Vasilyev V. V. , Predein A. V. , Varavin V. S. , Mikhailov N. N. , Dvoretsky S. A. , Gumenjuk-Sichevska J. V. , Golenkov A. G. , Reva V. P. , Sabinina I. V. , Sidirov Y. V. , Susliakov A. O. , Sizov F. F. , Aseev A. L.

tom Vol. 18, No. 3

332-337

The long wavelength (8-12 μm) IR FPA 288×4 based on a hybrid assembly of n+-p diode photosensitive arrays (PA) of HgCdTe (MCT) MBE-grown structures and time delay integration (TDI) readout integrated circuits (ROIC) with bidirectional scanning have been developed, fabricated, and investigated. The p-type MCT structures were obtained by thermal annealing of as-grown n-type material in inert atmosphere. The MCT photosensitive layer with the composition 0.20-0.23 of mole fraction of CdTe was surrounded by the wide gap layers to decrease the recombination rate and surface leakage current. The diode arrays were fabricated by planar implantation of boron ions into p-MCT. The typical dark currents were about 4-7 nA at the reverse bias voltage of 150 mV. The differential resistance R was up to R₀ = 1.6×10⁷ Ω zero bias voltage, which corresponded to R₀A ∼70 Ω •cm² and to the maximal value Rmax = 2.1 × 10⁸ Ω. The bidirectional TDI deselecting ROIC was developed and fabricated by 1.0-μm CMOS technology with two metallic and two polysilicon layers. The IR FPAs were free of defect channels and have the average values of responsivity Sλ = 2.27×10⁸ V/W, the detectivity Dλ * = 2.13 × 10¹¹ cm × Hz½ × W⁻¹, and the noise equivalent temperature difference NETD = 9 mK.