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2 Archives of Metallurgy and Materials

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Effect of Fe Content on the Contact Resistance of Electroplated Au-Fe Alloy Layers

100%

Park H. S. , Son I.

Archives of Metallurgy and Materials

2018

tom Vol. 63, iss. 3

1503--1507

In this study, variations in the contact resistance of electroplated Au-Fe alloy layers with Fe content were investigated. The contact resistance of electroplated Au-Fe alloy layers that were subject to thermal aging at 260°C in the atmosphere, tended to increase significantly with an increase in the Fe content. Through an analysis method employing X-ray photoelectron spectroscopy (XPS/ESCA) and Auger electron spectroscopy (AES), Ni oxides, such as NiO and Ni2O3, on the surface of the thermally aged electroplated Au-Fe alloy layers were observed. It is believed that the Ni oxide existing on the surface diffused from the underlying electroplated Ni layers to the surface through the grain boundaries in the electroplated Au-Fe layers during the thermal aging. As the Fe content in the electroplated Au-Fe layers increased, the grain size decreased. As the grain size decreases, more Ni oxide was detected on the surface. Therefore, with a rise in the Fe content, more Ni diffuses to the surface via grain boundaries, and more Ni oxide is formed on the surface of the electroplated Au-Fe layers, increasing the contact resistance of the electroplated Au-Fe alloy layers.

Effect of Electroless Ni–P Plating on the Bonding Strength of Bi–Te-Based Thermoelectric Modules

80%

Kim S. S. , Son I. , Kim K. T.

tom Vol. 62, iss. 2B

1225--1229

In the present study, electroless Ni–P plating was applied to Bi–Te-based thermoelectric materials as a barrier layer and the effect of the Ni–P plating on the bonding strength of the thermoelectric module was investigated. The bonding strength of the n- and p-type modules increased after being subjected to the electroless Ni–P plating treatment. In the case of the thermoelectric module that was not subjected to electroless Ni–P plating, Sn and Te were interdiffused and formed a brittle Sn–Te-based metallic compound. The shearing mostly occurred on the bonding interface where such an intermetallic compound was formed. On the other hands, it was found from the FE-EPMA analysis of the bonding interface of thermoelectric module subjected to electroless Ni-P plating that the electroless Ni-P plating acted as an anti-diffusion layer, preventing the interdiffusion of Sn and Te. Therefore, by forming such an anti-diffusion layer on the surface of the Bi–Te based thermoelectric element, the bonding strength of the thermoelectric module could be increased.

Effect of Electroless Ni–P Plating on the Bonding Strength of Bi–Te-Based Thermoelectric Modules

41%

Son I. , Kim S. S. , Kim K. T.