Czasopismo
1998
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Vol. 6, No. 1
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1-10
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The focal plane array (FPA) technology based on the PtSi Schottky-barrier (SB) photoemissive detector is presented. Taking advantage of Si-compatible manufacturing processes and high responsivity uniformity, we have developed a series of 2-dimensional PtSi SB FPAs with array sizes from 256 x 256 to 1040 x 1040 elements for medium wavelength thermal imaging, and two spaceborne long linear FPAs with 4096-element x 4-band and 2100-element x 6-band for short wavelength remote sensing applications. Along with design and performance of the FPAs, this paper reports on the Charge Sweep Device readout architecture, which is a key technology for high performance 2-D FPAs. A high reliability and high planarity packaging technology for large FPAs is also described.
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1-10
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Bibliogr. 26 poz.
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- Advanced Technology R&D Center, Mitsubishi Electric Corporation, 8-1-1, Tsukaguchi-Honmachi, Amagasaki City, Hyogo 661-8661, Japan, kimata@med.edl.melco.co.jp
Bibliografia
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bwmeta1.element.baztech-article-BWA1-0001-0253