Department of Integrated Circuits' and Systems' Design

• Autorzy: Szynka, J.
• Języki publikacji: EN

Słowa kluczowe

PL

Instytut Technologii Elektronowej; działalność naukowo-badawcza

EN

Institute of Electron Technology; scientific activity

• Czasopismo: Prace Instytutu Technologii Elektronowej
• Rocznik: 2010
• Tom: z. 1/2
• Strony: 163-192
• Opis fizyczny: Bibliogr. 36 poz., il., wykr.

Twórcy

autor

Szynka, J.

• Institute of Electron Technology, Al. Lotników 32/46, 02-668 Warsaw, Poland,

Bibliografia

• [P1] BIENIEK T., JANCZYK G., GRABIEC P., SZYNKA J.: Thermo-Mechanical Reliability Loop in Device Modeling. Proc. of the 15th Int. Workshop on Thermal Investigations of ICs and Systems THERMINIC 2009. Leuven, Belgium, 7-9.10.2009, p. 84-86.
• [P2] BIENIEK T., JANCZYK G., JANUS P., SZYNKA J., GRABIEC P.: Reliability Issues in Modeling and Simulations of the Heterogeneous Integrated Systems. Smart Systems Integration 2009 Conf. Proc. Brussels, Belgium, 10-11.03.2009, p. 428-431.
• [P3] GRABIEC P., KUŹMICZ W., NAPIERALSKI A.: Nanoelectronics in Poland: Barriers, Chances and Directions. Analysis of the Current State and Development Directions of Electronics and Telecommunications. Report of the Committee of Electronics and Telecommunications Nanoelectronics in Poland: Barriers, Chances and Directions. Current State and Development Prospects in Poland. Warsaw, Poland, 2009, p. 72-111. www.keit.pan.pl (in Polish)
• [P4] JANCZYK G., BIENIEK T., GRABIEC P., SZYNKA J.: Thermo-Mechanical Aspects of Reliability for Vertically Integrated Heterogeneous Systems. Proc. of the 16th Int. Conf. "Mixed Design of Integrated Circuits and Systems" MIXDES 2009. Lodz, Poland, 25-27.06.2009, p. 536-540.
• [P5] JANCZYK G., BIENIEK T., GRABIEC P., SZYNKA J.: Thermo-Mechanical Aspects of Reliability for Vertically Integrated Heterogeneous Systems. Elektronika 2009 vol. L no. 12 p. 83-87.
• [P6] JANCZYK G., BIENIEK T., SZYNKA J., GRABIEC P.: Reliability Aspects of 3D-Oriented Heterogeneous Device Related to Stress Sensitivity of MOS Transistors. Proc. of the IEEE Int. 3D Systems Conf. 2009. San Francisco, USA, 28-30.09.2009, CD, 2009, p. 1-6.
• [P7] JAROSZ A., PFITZNER A.: Evaluation of Interconnection Capacitances in ICs with Heterogeneous Isolating Materials. Proc. of the 16th Int. Conf. "Mixed Design of Integrated Circuits and Systems" MIXDES 2009, p. 427-432.
• [P8] JAROSZ A., PFITZNER A.: Calibration Aided Evaluation of Interconnection Capacitances for Statistical Simulation of ICs with Heterogeneous Isolating Materials. Elektronika 2009 vol. L no. 12 p. 35-39.
• [P9] KOCIUBIŃSKI A., DUK M., BIENIEK T., JANCZYK G.: Multidomain Modeling and Simulation of CVD Diamond Layers for MEMS/MOEMS. Prz. Elektrotechn. (submit. to print, in Polish).
• [P10] KURJATA-PFITZNER E., SZYMAŃSKI A., WĄSOWSKI J.: Influence of Process Variations on Parameters of Integrated therefore Circuits and Its Reduction Using Self-Calibration Methods. Elektronika 2009 vol. L no. 10 p. 137-145 (in Polish).
• [P11] MILITARU O., BERGAUER T., BERGHOLZ M., DE BOER W., BORRAS K., CORTINA GIL E., DIERLAMM A., DRAGICEVIC M., ECKSTEIN D., ERFLE J., FERNANDEZ M., FELD L., FREY M., FRIEDL M., FRETWURST E., GAUBAS E., GONZALES F. J., GRABIEC P., GRODNER M., HARTMANN F., HANSEL S., HOFFMANN K. H., HRUBEC J., JARAMILLO R., KARPINSKI W., KAZUKAUSKAS V., KLEIN K., KHOMENKOV V., KLANNER R., KRAMMER M., KUCHARSKI K., LANGE W., LEMAITRE V., MOYA D., MARCZEWSKI J., MUSSGILLER A., RODRIGO T., MULLER T., SAMMET J., SCHLEPER P., SCHWANDT J., SIMONIS J., SRIVASTAVA A., STEINBRUCK G., TOMASZEWSKI D., SAKALAUSKAS S., STORASTA J., VAITKUS J. V., LOPEZ VIRTO A., VILA I., ZASINAS E.: Simulation of Electrical Parameters of New Design of SLHC Silicon Sensors for Large Radii. Nucl. Instr. & Meth. in Phys. Res. A 2010 vol. 617 p. 563-564.
• [P12] SZCZĘSNY J.: Influence of the IC Construction on Electromagnetic Disturbance. Elektronika 2009 vol. L no. 11 p. 129-133 (in Polish).
• [C1] BIENIEK T., JANCZYK G.: ITE Part of Corona Vision. Corona WPS-WP10 Meet. Erfurt, Germany, 24.04.2009 (commun.).
• [C2] BIENIEK T., JANCZYK G.: ITE Status of the Work - eCubes Modeling and Simulations of the Health and Fitness Demonstrator. 11th e-Cubes SP2 Meet. Grenoble, France, 3-4.03.2009 (paper).
• [C3] BIENIEK T., JANCZYK G.: Status of WP 10: Demonstration of Business Cases for Customer-Driven Product Engineering. Corona WP4-7 Meet. + Corona General Meet. + Corona Exploitation Strategy Sem. Cambridge, Great Britain, 15-17.06.2009 (commun.).
• [C4] BIENIEK T., JANCZYK G., GRABIEC P., SZYNKA J.: Thermo-Mechanical Reliability Loop in Device Modeling. 15th Int. Workshop on Thermal Investigations of ICs and Systems THERMINIC 2009. Leuven, Belgium, 7-9.10.2009 (poster).
• [C5] BIENIEK T., JANCZYK G., JANUS P., SZYNKA J., GRABIEC P.: Reliability Issues in Modeling and Simulations of the Heterogeneous Integrated Systems. Smart Systems Integration 2009 Conf. Brussels, Belgium, 10-11.03.2009 (poster).
• [C6] BIENIEK T., JANCZYK G., JANUS P., SZYNKA J., GRABIEC P., KOCIUBIŃSKI A., EKWIŃSKA M., TOMASZEWSKI D., MALINOWSKI A.: Multi-Domain Modeling and Simulations of the Heterogeneous Systems. 8th Symp. "Diagnostic & Yield Advanced Silicon Devices and Technologies for ULSI Era". Warsaw, Poland, 22-24.06.2009 (poster).
• [C7] BIENIEK T., JANCZYK G., KALICIŃSKI S.: Status of WP 10: Demonstration of Business Cases for Customer-Driven Product Engineering. Corona General Meet. Warsaw, Poland 3-4.12.2009 (commun.).
• [C8] GRABIEC P., DUMANIA P., SZYNKA J.: Heterogenic Microsystems for Interdisciplinary Applications - Examples and Possibilities for Fabrication. Sem. of the National Institute of Telecommunications. Warsaw, Poland, 8.04.2009 (paper, in Polish).
• [C9] JANCZYK G., BIENIEK T.: Silicon Microsystem and Nanostructure Technology Department and Integrated Circuits and Systems Department for e-Cubes Project. eCubes 3-rd Partners Meet. Lausanne, Switzerland, 26-27.01.2009 (inv. lect).
• [C10] JANCZYK G., BIENIEK T.: Status of the Work - eCubes Device Stress Sensitivity Modeling for Basic IC Blocks (Analogue & Digital). 11th e-Cubes SP2 Meet. Grenoble, France, 3-4.03.2009 (inv. lect.).
• [C11] JANCZYK G., BIENIEK T.: Silicon Microsystem and Nanostructure Technology Department & Integrated Circuits and Systems Department for e-Cubes Project. 3rd eCubes Review Meet. Leuven, Belgium, 5-6.03.2009 (inv. lect.).
• [C12] JANCZYK G., BIENIEK T.: ITE Part of Corona Vision. Corona WP4-WP8 Meet. Siegen, Germany, 20-21.04.2009 (inv. lect.).
• [C13] JANCZYK G., BIENIEK T., GRABIEC P., SZYNKA J.: Thermo-Mechanical Aspects of Reliability for Vertically Integrated Heterogeneous Systems. 16th Int. Conf. "Mixed Design of Integrated Circuits and Systems" MIXDES 2009. Lodz, Poland, 25-27.06.2009 (paper).
• [C14] JANCZYK G., BIENIEK T., SZYNKA J., GRABIEC P.: Reliability Aspects of 3D-Oriented Heterogeneous Device Related to Stress Sensitivity of MOS Transistors. IEEE Int. 3D Systems Conf. 2009, San Francisco, USA, 28-30.09.2009 (poster).
• [C15] JANCZYK G., BIENIEK T., SZYNKA J., GRABIEC P.: Heterogeneous e-Cubes Device IC-Design Selected Design Guidelines 12th SP2 eCubes Meet. Monachium, Germany, 17-18.06.2009 (paper).
• [C16] JANCZYK G., ŁYSKO J.: Interlayer Cooling. Kick-off Meet. Interlayer Cooling. Zurich, Switzerland, 7.09.2009 (inv. Lect.).
• [C17] JAROSZ A., PFITZNER A.: Evaluation of Interconnection Capacitances in ICs with Heterogeneous Isolating Materials. 6th Int. Conf. "Mixed Design of Integrated Circuits and Systems" MIXDES 2009. Lodz, Poland, 25-27.06.2009 (poster).
• [C18] KOCIUBIŃSKI A., DUK M., BIENIEK T., JANCZYK G.: Multidomain Modeling and Simulation of CVD Diamond Layers for MEMS/MOEMS. 6th Int. Conf. "New Electrical and Electronic Technologies and Their Industrial Implementation" NEET 2009. Zakopane, Poland, 23-26.06.2009 (poster).
• [C19] KOCIUBIŃSKI A., DUK M., BIENIEK T., JANCZYK G.: 3-D Modeling of CVD Diamond Layers for MEMS Applications. 8th Symp. "Diagnostic & Yield Advanced Silicon Devices and Technologies for ULSI Era". Warsaw, Poland, 22-24.06.2009 (poster).
• [C20] MARCZEWSKI J., KUCHARSKI K., GRODNER M.: Strip Detectors for CEC. CEC Meet. (CMS-CERN). Barcelona, Spain, 17-18.09.2009 (inv. Lect).
• [C21] MILITARU O., BERGAUER T., BERGHOLZ M., BLUM P., DE BOER W., BORRAS K., CORTINA GIL E., DIERLAMM A., DRAGICEVIC M., ECKSTEIN D., ERFLE J., FERNANDEZ M., FELD L., FREY M., FRETWURST E., GAUBAS E., GONZALES F. J., GRABIEC P., GRODNER M., HARTMANN F., HANSEL S., HOFFMANN K. H., HRUBEC J., JARAMILLO R., KARPINSKI W., KAZUKAUSKAS V., KLEIN K., KHOMENKOV V., KLANNER R., KRAMMER M., KUCHARSKI K., LANGE W., LEMAITRE V., MOYA D., MARCZEWSKI J., MUSSGILLER A., RODRIGO T., MULLER T., SAMMET J., SCHWANDT J., SCHLEPER P., SIMONIS J., SRIVASTAVA A., STEINBRUCK G., TOMASZEWSKI D., SAKALAUSKAS S., STORASTA J., VAITKUS J. V.: Simulation of Electrical Parameters of New Design of SLHC Silicon Sensors for Large Radii. Frontier Detectors for Frontier Physics. La Biadola, Italy, 24-30.05.2009 (poster).
• [C22] OBRĘBSKI D., TOMASZEWSKI D., KUCHARSKI K., KŁOS H., GRABIEC P.: The MPW Service Provided by Institute of Electron Technology. 16th Int. Conf. "Mixed Design of Integrated Circuits and Systems" MIXDES 2009. Lodz, Poland, 25-27.06.2009 (paper).
• [C23] OBRĘBSKI D., TOMASZEWSKI D., KUCHARSKI K., KŁOS H., GRABIEC P., SZYNKA J.: The Multi Project Wafer Service Provided by Institute of Electron Technology. II Science and Technology Poland-East Forum. Białystok, Białowieża, Poland, 22-24.05.2009 (poster).
• [C24] SRIVASTAVA A., ECKSTEIN D., FRETWURST E., KLANNER R., STEINBRUCK G., HARTMANN F., BERGAUER T., DRAGICEVIC M., MUSSGILLER A., KHOMENKOV V., SCHLEPER P., SCHWANDT J., FELD L., KARPINSKI W., KLEIN K., SAMMET J., BERGHOLZ M., BORRAS K., ECKERLIN G., LANGE W., DE BOER W., BLUM P., DIERLAMM A., ERFLE J., FREY M., HOFFMANN H., MULLER T., SIMONIS J., CORTINA GIL E., LEMAITRE V, MILITARU O., FERNANDEZ M., GONZALES F. J., JARAMILLO R., LOPEZ VIRTO A., MOYA D., RODRIGO T., VILA L., FRIEDL M., HANSEL S., HRUBEC J., KRAMMERM., VAITKUS J. V., GAUBAS E., KAZUKAUSKAS V., SAKALAUSKAS S., STORASTA J., ZASINAS E., MARCZEWSKI J., GRABIEC P., KUCHARSKI K., GRODNER M., TOMASZEWSKI D.: Strixel Sensor Design for Large Radii of a New CMS Tracker for SLHC. IEEE Nucl. Sci. Symp. a. Medical Imaging Conf. Orlando, USA, 25-31.10.2009 (poster).