Electrical properties of dielectric foil for embedded PCB capacitors

• Autorzy: Piasecki, T. , Nitsch, K. , Dziedzic, A. , Chabowski, K.
• Języki publikacji: EN

Abstrakty

EN

One of the methods of achieving high packaging density of passive elements on the PCB is using the capacitors embedded in multilayer PCB. Test structures consisting of embedded capacitors were fabricated using the FaradFlexŽ capacitive internal layers. Impedance spectroscopy and equivalent circuit modelling was used to determine their electrical properties such as the capacitance, parasitic resistance and inductance. The use of several stages of accelerated ageing allowed us to test the durability of the structures. The results showed good quality stability of the embedded elements. The spatial distribution of the capacitance of the test structures on the surface of the PCB form was tested. The influence of the process parameters during lamination on the values of embedded capacitors was revealed.

Słowa kluczowe

EN

impedance spectroscopy; equivalent circuit; dielectric foil; embedded elements; PCB

• Czasopismo: Materials Science Poland
• Rocznik: 2012
• Tom: Vol. 30, No. 4
• Strony: 335--341
• Opis fizyczny: Bibliogr. 11 poz., rys.

Twórcy

autor

Piasecki, T.

autor

Nitsch, K.

autor

Dziedzic, A.

autor

Chabowski, K.

• Faculty of Microsystem Electronics and Photonics, Wrocław University of Technology,ul. Janiszewskiego 11/17, 50-372 Wrocław, Poland

Bibliografia

• [1] DZIEDZIC A., KŁOSSOWICZ A., WINIARSKI P.,NITSCH K., PIASECKI T., KOZIOŁ G., STEPLEWSKI W., Przeglad Elektrotechniczny, in press.
• [2] STEPLEWSKI W., BORECKI J., KOZIOŁ G., ARAZNA A., DZIEDZIC A., MARKOWSKI P., Elektronika, 52 (2011) 119.
• [3] ULRICH R.K., SCHAPER L.W. (editors), Integrated Passive Component Technology, Wiley Interscience – IEEE Press, 2003.
• [4] MACDONALD J.R., Impedance Spectroscopy: Emphasizing Solid Materials and Systems, John Wiley, 1987.
• [5] BORSUKOV E., MACDONALD J.R., Impedance spectroscopy. Theory, Experiment and Applications, John Wiley, 2005.
• [6] Technical datasheet: FARADFLEX® BC8TM, BC12TM,Ultra Thin Advanced Electronic Materials.
• [7] Technical datasheet: FARADFLEX® BC8M, BC12M,BC16M and BC24M Ultra Thin Advanced Electronic Materials.
• [8] PIASECKI T., WRONSKI ´ M., DUDEK M., NITSCH K., Elektronika, 3 (2011) 74.
• [9] MULDER W.H., SLUYTERS J.H., PAJKOSSY T.,NYIKOS L., J. Electroanalytical Chemistry and Interfacial Electrochemistry, 285 (1990) 103.
• [10] JORCIN J-B., ORAZEM M.E., PEBERE N., TRIBOLLET B., Electrochimica Acta, 51 (2006) 1473.
• [11] TADASZAK K., NITSCH K., PIASECKI T., POSADOWSKI W., Microelectronics Reliability, 51 (2011) 1225.