Quantitative mapping of elastic properties of electron-beam damaged silica-based low-k films

• Autorzy: Jiang, L. , Geisler, H. , Zschech, E.
• Języki publikacji: EN

Abstrakty

EN

A quantitative technique for mapping of elastic modulus performed on organosilicate glass (OSG) thin films with different surface conditions is described. This modulus mapping technique provides highly valuable information about the elastic properties at the very near-surface region of the films. The results show that low-k films can be modified by electron beams, leading to a near-surface region with increased stiffness. Compared with quasi-static nanoindentation, the modulus mapping technique is more surface sensitive, and therefore, it has a better capability to detect slight differences of elastic properties between ultra-thin films of different thickness on top of OSG films.

Słowa kluczowe

EN

modulus mapping; nanoindentation; low-k; electron-beam damage; surface

• Czasopismo: Materials Science Poland
• Rocznik: 2005
• Tom: Vol. 23, No. 3
• Strony: 643--651
• Opis fizyczny: Bibliogr. 10 poz., rys., tab.

Twórcy

autor

Jiang, L.

• Gesellschaft für Wissens- und Technologietransfer der TU Dresden mbH, Chemnitzer Strasse 48 b, D-01187 Dresden, Germany

autor

Geisler, H.

• AMD Saxony LLC & Co. KG, Materials Analysis Department, Wilschdorfer Landstrasse 101, D-01109 Dresden, Germany

autor

Zschech, E.

• AMD Saxony LLC & Co. KG, Materials Analysis Department, Wilschdorfer Landstrasse 101, D-01109 Dresden, Germany,

Bibliografia

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