Thermal residual stress state in laser diode / heatsink joint systems depending on the proporties of the heatsink material. FEM analysis.

• Autorzy: Kaliński, D.
• Języki publikacji: EN

Abstrakty

EN

The paper presents the results of calculations, performed using the finite element method (FEM) which include a comperative analysis of the residual stress state induced in the GaAs laser diode / heatsink joint systems that differed from one another in the material used for the heatsin (Cu, CuCf, AIN). This analyssis permited us to test the materials examined in terms of the level and distribution of the residual stresses developed in the system during its joining operation. The calculation results show, among other things, that in the model with the CuCf composite the maximum level of tensile stresses generated in GaAs is about 6 times lower than that in the systems with a conventional copper heatsink.

Słowa kluczowe

PL

MES (metoda elementów skończonych); stan naprężenia; radiator; dioda laserowa

EN

FEM; stress state; heat sink; laser diode

• Czasopismo: Materiały Elektroniczne
• Rocznik: 2002
• Tom: T. 30, nr 3
• Strony: 15-27
• Opis fizyczny: Bibliogr. 10 poz., rys., tab.

Twórcy

autor

Kaliński, D.

• Instytut Technologii Materiałów Elektronicznych, Ul. Wólczyńska 133 01-919 Warszawa,