Warianty tytułu
Konferencja
12th International Scientific Conference CAM3S'2006, 27-30th November 2006, Gliwice-Zakopane
Języki publikacji
Abstrakty
Purpose: The objective of the work was to investigate changes in structure and properties of Cu-WC microcomposites which take place in the process of controlled hot deformation of materials of nanometric initial structure. Design/methodology/approach: Tests were made with the Cu-WC micro-composites containing up to 2% of a hardening phase. These were obtained by powder metallurgy techniques and further hot deformation. The mechanical properties and microstructure (by the optical, scanning and transmission electron microscopy) were examined. Findings: Analysis of the initial nanocrystalline structure of these materials was made, and its evolution during hot deformation process was investigated with an account of the changes in the mechanical and electrical properties. Research limitations/implications: The powder metallurgy techniques make it possible to obtain copper-based bulk materials. Globular structure and high porosity of this materials result in their limited mechanical properties. This is the reason why additional operations, should be applied. The investigations have revealed that controlled hot deformation, within the temperature range of 500-550 degrees centigrade, gives possiblity for obtaining submicron grain size and more advantageous mechanical properties of Cu-WC microcomposites. Practical implications: A growing trend to use new copper-based functional materials is observed recently world-wide. Within this group of materials particular attention is drawn to dispersion hardened microcomposites with nanometric or submicron grain size of a copper matrix, which exhibit higher mechanical properties. Originality/value: The paper shows instability of nanostructure of Cu-WC microcomposites in the processes of hot deformation. A controlled process, which can lead to destruction of globular structure, significant improvement of density and obtaining of submikron size, gives possibility for significant improvements in functional properties of the materials.
Rocznik
Tom
Strony
195-198
Opis fizyczny
Bibliogr. 15 poz., fot., rys.
Twórcy
autor
autor
autor
- Non-Ferrous Metals Institute, ul. Sowińskiego 5, 44-100 Gliwice and Division of Materials Processing Technology, Management and Computer Techniques in Materials Science, Institute of Engineering Materials and Biomaterials, Silesian University of Technolo, jerzys@amme.com
Bibliografia
- [1] Z.M. Rdzawski, J.P.Stobrawa, Structure of coherent precipitates in aged copper alloy, Scripta Metallurgica., 20 (1986) 341-344.
- [2] J.P. Stobrawa, Z.M. Rdzawski, Inhomogenous precipitation in aged Cu-Cr alloy, Scripta Metallurgica 21, (1987) 1269-1271.
- [3] Z.M. Rdzawski, J.P. Stobrawa, Thermomechanical processing of Cu-Ni-Si-Cr-Mg alloy, Materials Science and Technology, 9 (1993) 142-149.
- [4] J.P. Stobrawa, Z.M. Rdzawski, Formation of a stable nanostructure in the copper-based materials, Proceedings of the 11th International Scientific Conference on Contemporary Achievement in Mechanics, Manufacturing and Materials Science, CAM3S'2005, Gliwice-Zakopane, 2005, 909-914.
- [5] J.P. Stobrawa, Z.M. Rdzawski, Formation of a stable nanostructure in the copper-based materials, Journal of Materials Processing Technology, in press.
- [6] V. Rajkovic, at al. (1998) Copper matrix strengthening in Cu-Al203 system by mechanical alloying and milling of pure copper and prealloyed copper powders. Advanced Science and Technology of Sintering, (1988) 537-543.
- [7] D.Y. Ying, D.L. Zhang, Processing of Cu-Al2O3 metal matrix nanocomposite materials by using high energy ball milling, Materials Science and Engineering, 1 (2000) 152-156.
- [8] A. Zuniga, Microstructure and mechanical behavior of Cu-based composites reinforced with WC and TiC particles, prepared by spray forming. Proceedings of the Second International Latin American Conference on powder Technology, Iquacu, Brasil, Nov. 1999.
- [9] N. Wang at al., Effect of grain size on mechanical properties of nanocrystalline materials, Acta Metal. Mater, 2c (1995) 519-528.
- [10] Y.J. Li, X.H. Zeng, W. Blum, Transition from strengthening to softening by grain boundaries in ultrafine-grained Cu, Acta Materialia, 52 (2004) 5009-5018.
- [11] R. Suryanarayanan at. al., Plastic deformation of nanocrystalline Cu and Cu-0,2 wt.% B, Materials Science and Engineering, 264 (1999) 210-214.
- [12] H. Conrad, Grain size dependence of the plastic deformation kinetics in Cu, Materials Science and Engineering, 341 (2003) 216-228.
- [13] K.S.Kumar, H. Van Swygenhoven, S. Suresh. Mechanical behaviour of nanocrystalline metals and alloys, Acta Materialia, 51 (2003) 5743-5774.
- [14] S.H. Yoo, T.S. Sudarshan, K. Sethuram, at al., Nano Structured Materials, 12 (1999) 23-28.
- [15] D.V. Kudashov at. al., Microstructure and room temperature hardening of ultra-fine-grained oxide-dispersion strengthened copper prepared by cryomilling. Materials Science and Engineering, 387-379 (2004) 768-771.
Typ dokumentu
Bibliografia
Identyfikatory
Identyfikator YADDA
bwmeta1.element.baztech-article-BOS5-0018-0038