Analysis of electromigration phenomenon in thick-film and LTCC structures at elevated temperature

• Autorzy: Nowak, D. , Stafiniak, A. , Dziedzic, A.
• Języki publikacji: EN

Abstrakty

EN

Studies on electromigration phenomenon in thick-film structures on alumina and LTCC substrates are presented in this paper. The effects of storage of Au and Ag electrode patterns in temperature range up to 300 °C under voltage bias were examined. The leakage characteristics of electrodes with 100 μm spacing at 50 V dc bias as a function of time and temperature are presented and analyzed. Scanning electron microscope (SEM) equipped with the energy-dispersive X-ray spectroscopy (EDX) detector was applied for determination of metal ions transport. Test structures with Au-based conductive material are much more resistant to electromigration than Ag-based layers.

Słowa kluczowe

EN

LTCC; thick-film; electromigration; reliability

• Czasopismo: Materials Science Poland
• Rocznik: 2014
• Tom: Vol. 32, No. 2
• Strony: 247--251
• Opis fizyczny: Bibliogr. 9 poz., rys., tab., wykr.

Twórcy

autor

Nowak, D.

autor

Stafiniak, A.,

autor

Dziedzic, A.

• Faculty of Microsystem Electronics and Photonics, Wroclaw University of Technology,Wybrzeze Wyspianskiego 27, 50-370 Wrocław, Poland,

Bibliografia

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Identyfikatory

DOI

10.2478/s13536-013-0182-9