Influence of plastic deformation temperature on the structure and mechanical properties of low-alloy copper alloys with Co, Ni and B

• Autorzy: Grzegorczyk, B. , Ozgowicz, W.
• Języki publikacji: EN

Abstrakty

EN

Purpose: This work presents the influence of chemical composition and plastic deformation temperature of CuCoNi and CuCoNiB as well as CuCo2 and CuCo2B alloys on the structure, mechanical properties and, especially on the inter-crystalline brittleness phenomenon and ductility minimum temperature effect in tensile testing with strain rate of 1.2·10-3 s-1 in the range from 20°C to 800°C. Design/methodology/approach: The tensile test of the investigated copper alloys was realized in the temperature range of 20-800°C with a strain rate of 1.2·10-3 s–1 on the universal testing machine. Metallographic observations of the structure were carried out on a light microscope and the fractographic investigation of fracture on an electron scanning microscope. Findings: Low-alloy copper alloys such as CuCo2 and CuCo2B as well as CuCoNi and CuCoNiB show a phenomenon of minimum plasticity at tensile testing in plastic deforming temperature respectively from 500°C to 700°C for CuCo2, from 450°C to 600°C for CuCo2B and from 450°C to 600°C for CuCo2B and from 500°C to 600°C for CuCoNiB. Practical implications: In result of tensile tests of copper alloys it has been found that the ductility minimum temperature of the alloys equals to about 500°C. At the temperature of stretching of about 450°C the investigated copper alloys show maximum strength values. Originality/value: Based on the test results the temperature range for decreased plasticity of CuCoNi and CuCoNiB as well as CuCo2 and CuCo2B alloys was specified. This brittleness is a result of decreasing plasticity in a determined range of temperatures of deforming called the ductility minimum temperature.

Słowa kluczowe

PL

stop miedzi; odkształcenie plastyczne; temperatura minimalnej plastyczności; właściwości mechaniczne; mikrostruktura

EN

copper alloy; plastic deformation; ductility minimum temperature; mechanical properties; microstructure

• Czasopismo: Archives of Materials Science and Engineering
• Rocznik: 2017
• Tom: Vol. 84, nr 2
• Strony: 49--57
• Opis fizyczny: Bibliogr. 11 poz.

Twórcy

autor

Grzegorczyk, B.

• Division of Constructional and Special Materials, Institute of Engineering Materials and Biomaterials, Silesian University of Technology, ul. Konarskiego 18a, 44-100 Gliwice, Poland,

autor

Ozgowicz, W.

• Division of Constructional and Special Materials, Institute of Engineering Materials and Biomaterials, Silesian University of Technology, ul. Konarskiego 18a, 44-100 Gliwice, Poland

Bibliografia

• [1] W. Ozgowicz, The relationship between hot ductility and intragranular fracture in a CuSn6P alloy at elevated temperatures, Journal of Materials Processing Technology 162-163 (2005) 392-401.
• [2] R. Sandström, R. Wu, Influence of phosphorus on the creep ductility of copper, Journal of Nuclear Materials 441 (2013) 364-371.
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• [4] P. Sakiewicz, R. Nowosielski, R. Babilas, D. Gąsiorek, M. Pawlak, FEM simulation of Ductility Minimum Temperature (DMT) phenomenon in CuNi25 alloy, Journal of Achievements in Materials and Manufacturing Engineering 61/2 (2013) 274-280.
• [5] W. Ozgowicz, B. Opeldus, The influence of the chemical composition and temperature of plastic deformation on the PLC effect in tin bronzes, Journal of Achievements in Materials and Manufacturing Engineering 17 (2006) 129-132.
• [6] W. Ozgowicz, E. Kalinowska-Ozgowicz, B. Grzegorczyk, The influence of the temperature of tensile test on the structure and plastic properties of copper alloy type CuCr1Zr, Journal of Achievements in Materials and Manufacturing Engineering 29/2 (2008) 143-146.
• [7] P.J. Henderson, R. Sandström, Low temperature creep ductility of OFHC copper, Materials Science and Engineering A 246 (1998) 143-150.
• [8] V.V.C. Wan, M.A. Cuddihy, J. Jiang, D.W. MacLachlan, F.P.E. Dunne, An HR-EBSD and computational crystal plasticity investigation of microstructural stress distributions and fatigue hotspots in polycrystalline copper, Acta Materialia 115 (2016) 45-57.
• [9] P. Henderson, J-O. Österberg, B. Ivarsson, Low Temperature Creep of Copper Intended for Nuclear Waste Containers, SKB, Technical Report TR-92-04, 1992.
• [10] A.K. Shukla, R. Suresh Kumar, S.V.S. Narayana Murty, K. Mondal, Enhancement of high temperature ductility of hot-pressed Cu-Cr-Nb alloy by hot rolling, Materials Science and Engineering A 577 (2013) 36-42.
• [11] L. Kommel, I. Hussainova, O. Volobueva, Microstructure and properties development of copper during severe plastic deformation, Materials and Design 28/7 (2007) 2121-2128.

Identyfikatory

DOI

10.5604/01.3001.0010.0978