Warianty tytułu
Przegląd metod wykorzystania mikroskopów akustycznych do analizy uszodzeń układów półprzewodnikowych
Języki publikacji
Abstrakty
This paper is a review on the part of the failure analysis in the semiconductor region, especially in the integrated circuit (IC) design. Initially, the literature review depends on the keyword of acoustic-microscopy. Then, it followed by the example on the scanning acoustic-microscope (SAM), confocal scanning acoustic-microscope (CSAM), and C-mode scanning acoustic-microscope (C-SAM) technique. These three SAM techniques are used in various situation and have a different effect on the sample. Previous works on SAM, C-SAM and CSAM related technologies are reviewed by many researchers in this paper.
W artykule przedstawiono przegląd analizy defektów układów półprzewodnikowych (obwodów scalonych) z wykorzystaniem mikroskopów akustycznych. Zaprezentowano mikroskop akustyczny SAM, mikroskop skaningowy CSAM i mikroskop typu C C-SAM. Każda z tych metod pozwala na różnego typu badania.
Czasopismo
Rocznik
Tom
Strony
9--14
Opis fizyczny
Bibliogr. 29 poz., rys.
Twórcy
autor
- Center for Telecommunication Research and Innovation (CeTRI), Faculty of Electronic and Computer Engineering (FKeKK), Universiti Teknikal Malaysia Melaka (UTeM), Malaysia, Badrulhisham@utem.edu.my
autor
- Center for Telecommunication Research and Innovation (CeTRI), Faculty of Electronic and Computer Engineering (FKeKK), Universiti Teknikal Malaysia Melaka (UTeM), Malaysia, taha.alsheikhly@gmail.com
autor
- Center for Telecommunication Research and Innovation (CeTRI), Faculty of Electronic and Computer Engineering (FKeKK), Universiti Teknikal Malaysia Melaka (UTeM), Malaysia, nornikman@utem.edu.my
autor
- Center for Telecommunication Research and Innovation (CeTRI), Faculty of Electronic and Computer Engineering (FKeKK), Universiti Teknikal Malaysia Melaka (UTeM), Malaysia, Lim@gmail.com
autor
- ST Microelectronics sdn. bhd, Tanjong Agas, Muar, Johor, Malaysia, ayman971972@gmail.com
autor
- Center for Telecommunication Research and Innovation (CeTRI), Faculty of Electronic and Computer Engineering (FKeKK), Universiti Teknikal Malaysia Melaka (UTeM), Malaysia, nurulsyahira602@gmail.com
Bibliografia
- 1] N. Hassan, B. H. Ahmad, M. Z. Sarip, P. E. Lim, and Z. Zakaria, “Failure Analysis in Focused Ion Beam (FIB) Technology of Ion Channeling Contrast (ICC) and Electron Channeling Contrast (ECC): A Review,” ARPN J. Eng. Appl. Sci., 2019. 14,(13), pp. 2437–2442.
- [2] A. M. Ibrahim, I. M. Ibrahim, and N. A. Shairi, “Compact MIMO Antenna for LTE and 5G Communications,” Prozlad Elektrotechniczny,2020. (10), pp.43-46.
- [3] A. M. Ibrahim, I. M. Ibrahim, and N. A. Shairi, “Compact MIMO Slots Antenna Design with Different Bands and High Isolation for 5G Smartphone Application, ”Baghdad Science Journal,2019. 16, (4), pp.1093–1102.
- [4] R. Wiesendanger, Nanoscience and Technology, 2007.2, (PART 2), PP.121–123.
- [5] F. Dunn and W. J. Fry, “Ultrasonic absorption microscope,” J. Acoust. Soc. Am., 1959. 31, (5), pp. 632–633.
- [6] H. Lee, “Acoustical Sensing and Imaging, 1st ed. CRC Press is an imprint of Taylor & Francis Group, an Informa business, 2016. pp. 1–133.
- [7] N. Nowicki, J. Litniewski, and T. Kujawska, “Acoustical Imaging. ”, Springer Science+Business, 1985. 14. (31), pp. 101–112.
- [8] A. Nowicki, J. Litniewski, and T. Kujawska, “Acoustical Imaging,” Springer Science+Business Media Singapore, 2015. 53, (9), pp.1689–1699.
- [9] T. Kundu, “Acoustic Microscopy At Low Frequency,” Am. Soc. Mech. Eng., 1988. 55, (9), pp. 545–550.
- [10] R. K. Pitler, “Nondestructive Evaluation and Quality Control,”. ASM International, 1992., 17, (5), pp. 465–482.
- [11] Chertov, A., Maev, RGr.,“One-Dimensional Model of Acoustic Wave Propagation in The Multilayered Structure of The Spot Weld, IEEE Trans Ultrason Ferroelectr Freq Control,” 2005. 52, (10), pp.1783–1790.
- [12] A. Jakob et al.,“Comparison of Different Piezoelectric Materials for Ghz Acoustic Microscopy Transducers,” Proc. - IEEE Ultrason. Symp., 2009, 35, (3), pp.1722–1725.
- [13] J. Mamou and D. Rohrbach, “Image Formation Methods in Quantitative Acoustic Microscopy,” IEEE Int. Conf. Acoust. Speech, Signal Process. 2017. 14, (3), pp. 6259–6263.
- [14]P. A. Meignen, E. Le Clezio, T. Delaunay, and G. Despaux, “Multi-Element Transducer Dedicated to Quantitative Acoustic Microscopy Imaging,” Proc. IEEE Sensors, 2017. 3, (12), pp. 1–3.
- [15]Maev, R. G., “Acoustic Microscopy for Materials Characterization, Materials Characterization Using Nondestructive Evaluation (NDE) Methods,” University of Windsor, ON, Canada, 2016. 1, (6), pp. 161–175.
- [16] Cheitov, A. M., Maev, R. G., & Severin, F. M., “Acoustic Microscopy of Internal Structure of Resistance Spot Welds,” IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control,2007. 54(8), 1521–1529.
- [17] R. A. Lemons and C. F. Quate, “Acoustic Microscope - Scanning Version,” Appl. Phys. Lett., 1974. 24, (4), pp. 163– 165.
- [18] K. Miura and S. Yamamoto, “A Scanning Acoustic Microscope Discriminates Cancer Cells in Fluid,” Sci. Rep., 2015. 5, (1), pp. 1–11.
- [19] R. Kohli, “Developments in Imaging and Analysis Techniques for Micro- and Nanosize Particles and Surface Features”, Rajiv Kohli & K.L. Mittal, 2012. 4, (1), pp.215–285.
- [20] K. Miura, H. Nasu, and S. Yamamoto, “Scanning Acoustic Microscopy for Characterization of Neoplastic And Inflammatory Lesions of Lymph Nodes,” Sci. Rep., 2013. 3, (1), pp. 1–10.
- [21] S. Oberhoff, K. Goetz, K. Trojan, M. Zoeller, and J. Glueck, “Application of High Frequency Scanning Acoustic Microscopy for The Failure Analysis and Reliability Assessment of MEMS Sensors,” Microelectron. Reliab., 2016. 64, (3), pp. 656–659.
- [22] H. T. Lee, M. Wang, R. Maev, and E. Maeva, “A Study on Using Scanning Acoustic Microscopy And Neural Network Techniques to Evaluate The Quality of Resistance Spot Welding,” Int. J. Adv. Manuf. Technol., 2003. 22, (9), pp. 727– 732.
- [23] A. Nwaneshiudu, C. Kuschal, F. H. Sakamoto, R. Rox Anderson, K. Schwarzenberger, and R. C. Young, “Introduction to confocal microscopy,” J. Invest. Dermatol., 2012. 132, (12), pp. 1–5.
- [24] A. Koskinen, J. Haapalainen, I. Virkkunen, and M. Kemppainen, “Differences in Ultrasonic Indications – Thermal Fatigue Cracks and EDM Notches,” World Conf. Nondestruct. Test., 2012, 12, (4), pp. 16–20.
- [25] K. Mugunan, L. C. Ying, and C. C. Fei, “Verification of Delamination Observed in SAM Transmission Mode (Thru- Scan) Using Reflection Mode (C-SAM Bottom Scan),” Int. Electron. Manuf. Technol. Conf. IEMT 2018. 13, (M), pp. 1–6.
- [26] E. W. Soon Kiong and C. Y. Lai, “Assessment Methodology on Mold Void Defect by Scanning Acoustic Microscopy (SAM) Non-Destructive Technique,”Int. Electron. Manuf. Technol. Conf. IEMT 2018, 53, (7), pp. 1–4.
- [27] De Wolf, I. Khaled, A. Kim, S. W. Beyne, E. Kogel, M. Brand, S. Djuric-Rissner and T. Wiesler, "Detection of Local Cu-to-Cu Bonding Defects in Wafer-to-Wafer Hybrid Bonding using GHz- SAM", Proceedings of the 44th International Symposium for Testing and Failure Analysis (ISTFA), 28 October - 1 November 2018, pp. 8-11.
- [28] A. P. Sampath and S. Sohn, "An overview of non-destructive testing methods for integrated circuit packaging inspection", Sensors 2018, 1981.
- [29] F.Bertocci, A. Grandoni and T. D. Rissner, "Scanning Acoustic Microscopy (SAM):A Robust Method for Defect Detection during the Manufacturing Process of Ultrasound Probes for Medical Imaging", 2019, pp. 1-19.
Uwagi
Opracowanie rekordu ze środków MNiSW, umowa Nr 461252 w ramach programu "Społeczna odpowiedzialność nauki" - moduł: Popularyzacja nauki i promocja sportu (2021).
Typ dokumentu
Bibliografia
Identyfikatory
Identyfikator YADDA
bwmeta1.element.baztech-067b43b5-0ffc-47d3-80d7-f16d4e849b33