Warianty tytułu
Języki publikacji
Abstrakty
Wydawca
Czasopismo
Rocznik
Numer
Opis fizyczny
p.26-30,fig.,ref.
Twórcy
autor
- Technical University of Lodz, Lodz, Poland
Bibliografia
- [1] Chalmers I.R. - The effect of humidity on packaging grade paper elastic modulus. Appita Journal 51, nr 1/1998, p.25-26.
- [2] Schröder A., Bensarsa D.- The Young’s modulus of wet paper. Journal of Pulp & Paper Science 28, nr12/2002, p. 410-415.
- [3] Zauscher S., Caulfield D.F., Nissan A. - The influence of water on the elastic modulus of paper. Part 1: Extension of the H-bond theory. Tappi Journal 12/1996, p.178-182.
- [4] Zauscher S., Caulfield D.F., Nissan A. - The influence of water on the elastic modulus of paper. Part 2: Verification of predictions of the H-bond theory. Tappi Journal 1/1997, p.214-223.
- [5] Baranek E., Janiga U. - Climate and strength of paper packaging (in Polish). Papermaking Review 59, 8/2003 p. 476-478.
- [6] Strumiłło C.- Chemical engineering (in Polish) WNT Warsaw 58, 1983.
Typ dokumentu
Bibliografia
Identyfikatory
Identyfikator YADDA
bwmeta1.element.agro-33568f2f-8adc-4820-a19c-c3a9c48c1834