Characterization of the surface topography and nano-hardness of Cu/Ni multilayer structures

• Autorzy: Edyta Kulej , Barbara Kucharska , Grzegorz Pyka , Monika Gwoździk
• Języki publikacji: EN

Abstrakty

EN

This article describes the results of a study of Cu/Ni multilayer coatings applied on a monocrystalline Si(100) silicon substrate by the deposition magnetron sputtering technique. Composed of 100 bilayers each, the multilayers were differentiated by the Ni sublayer thickness (1.2 to 3 nm), while maintaining the constant Cu sublayer thickness (2 nm). The multilayer coatings were characterized by assessing their surface topography using atomic force microscopy and their mechanical properties with nano-hardness measurements by the Berkovich method. The tests showed that the hardness of multilayers was substantially influenced by the thickness ratio of Cu and Ni sublayers and by surface roughness. The highest hardness and, at the same time, the lowest roughness was exhibited by a multilayer structure with a Cu-to-Ni sublayer thickness ratio of 2:1.5.

Słowa kluczowe

EN

Cu/Ni multilayer; nanohardness; atomic force microscopy

• Czasopismo: Open Physics
• Rocznik: 2011
• Tom: 9
• Numer: 6
• Strony: 1421-1425

Daty

wydano

2011-12-01

online

2011-10-15

Twórcy

autor

Edyta Kulej

• Institute of Materials Engineering, Czestochowa University of Technology, al. Armii Krajowej 19, 42-200, Czestochowa, Poland,

autor

Barbara Kucharska

• Institute of Materials Engineering, Czestochowa University of Technology, al. Armii Krajowej 19, 42-200, Czestochowa, Poland

autor

Grzegorz Pyka

• Department of Metallurgy and Materials Engineering, Katholieke Universiteit Leuven, B-3001, Heverlee, Belgium

autor

Monika Gwoździk

• Institute of Materials Engineering, Czestochowa University of Technology, al. Armii Krajowej 19, 42-200, Czestochowa, Poland

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Identyfikatory

DOI

10.2478/s11534-011-0055-y