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Warianty tytułu
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Abstrakty
In this research a new process of plasma oxidation of crystalline silicon at room temperature is studied. The plasma oxidation was carried out using Diffuse Coplanar Surface Barrier Discharge (DCSBD) operating in ambient air and oxygen at atmospheric pressure. The influence of exposition time, plasma parameters and crystallographic orientation of silicon on oxidized layers and their dielectric properties were investigated. Thickness, structure and morphology of these layers were studied by ellipsometry, infrared absorption spectroscopy and scanning electron microscopy. During the treatment time, from 1 to 30 minutes, oxidized layers were obtained with thickness from 1 to 10 nm. Their roughness depends on the crystallographic orientation of silicon surface and exposure time. Electrical parameters of the prepared layers indicate the presence of an intermediate layer between silicon substrate and the oxidized layer.
Słowa kluczowe
Czasopismo
Rocznik
Tom
Numer
Opis fizyczny
Daty
otrzymano
2014-01-31
zaakceptowano
2014-05-08
online
2014-11-26
Twórcy
autor
- Department of Physical Electronics, Faculty of Science, Masaryk University, Kotlářská 2, 611 37, Brno, Czech Republic
autor
- Department of Physics, Faculty of Education, Masaryk University, Poříčí 7, 603 00, Brno, Czech Republic
autor
- Department of Physical Electronics, Faculty of Science, Masaryk University, Kotlářská 2, 611 37, Brno, Czech Republic
autor
- Department of Physics, Faculty of Education, Masaryk University, Poříčí 7, 603 00, Brno, Czech Republic
autor
- Department of Physical Electronics, Faculty of Science, Masaryk University, Kotlářská 2, 611 37, Brno, Czech Republic
autor
- Institute of Physics, University of Greifswald, Felix-Hausdorff-Strasse 6, 17487, Greifswald, Germany
autor
- Department of Physical Electronics, Faculty of Science, Masaryk University, Kotlářská 2, 611 37, Brno, Czech Republic
Bibliografia
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Typ dokumentu
Bibliografia
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bwmeta1.element.-psjd-doi-10_1515_chem-2015-0047