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Verification of a binary fluid solidification model using semi-analitycal solution of 1D heat diffusion equation

Wacławczyk T., Schäfer M.

Chemical and Process Engineering

2018

Vol. 39, nr 1

85–-102

The aim of the present work is to verify a numerical implementation of a binary fluid, heat conduction dominated solidification model with a novel semi-analytical solution to the heat diffusion equation. The semi-analytical solution put forward by Chakaraborty and Dutta (2002) is extended by taking into account variable in the mushy region solid/liquid mixture heat conduction coefficient. Subsequently, the range in which the extended semi-analytical solution can be used to verify numerical solutions is investigated and determined. It has been found that linearization introduced to analytically integrate the heat diffusion equation impairs its ability to predict solidus and liquidus line positions whenever the magnitude of latent heat of fusion exceeds a certain value.