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1 International Journal of Electronics and Telecommunications

1 2025

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Biodegradable shellac-based substrates of various types for transient printed electronics

Cichocki-Łukasiewicz Radosław, Synkiewicz-Musialska Beata, Zachariasz Piotr, Kołaszczyński Grzegorz, Uppuluri Kiranmai, Kula Karolina, Skwarek-Łukasiewicz Agata

International Journal of Electronics and Telecommunications

2025

Vol. 71, No. 1

107-112

This work reports on the synthesis and properties of various shellac-based substrates for microelectronics applications. The analysis of the materials included temperature resistance and water solubility inspection. Low dielectric constant and dissipation factor as same as good integration of screen printed electrodes observed during SEM analysis, confirmed potential of shellac-based materials as substrates for transient, environmentally friendly electronic devices.