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Ecological Electroplating Baths and Their Application in the Tin-coating of Copper Wires Intended for Photovoltaic Cables

Olędzki Aleksander, Knych Tadeusz, Zasadzińska Małgorzata

Journal of Casting & Materials Engineering

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2023

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Vol. 7, no. 3

31--40

EN

Copper wires are covered with various coatings for many different applications. The most popular are tin based coatings and both their thickness and quality have been standardized by means of appropriate standard specifications. Copper wires intended for photovoltaic cables are subjected to especially high requirements due to their exceptionally long operating time and extremely unfavourable working conditions. Tin coatings are applied using the electroplating method and generally a fluoroborate bath is used during the process, however, it has been proved to be a health hazard in general and harmful to the environment as a whole. The paper presents the research results of a new ecological methane-sulfonate bath which does not form hazardous waste in the process. The examples of tin coatings of various thickness and the way of obtaining them at varying electrodeposition speeds at constant current or constant speed with varying current intensity were analysed. It has been determined that the use of the new electroplating bath is not only beneficial from an ecological point of view, but also in terms of the coating quality and efficiency of the process.

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Research of mechanical and electrical properties of Cu–Sc and Cu–Zr alloys

Franczak Krystian, Kwaśniewski Paweł, Kiesiewicz Grzegorz, Zasadzińska Małgorzata, Jurkiewicz Bartosz, Strzępek Paweł, Rdzawski Zbigniew

Archives of Civil and Mechanical Engineering

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2020

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Vol. 20, no. 1

390--404

EN

The research paper presents the impact of the scandium additive and various conditions of the heat treatment on copper mechanical, electrical and heat resistance properties. The performed research works included manufacturing of CuSc0.15 and CuSc0.3 alloys through metallurgical synthesis with the use of induction furnace and following crystallization in graphite crucibles at ambient temperature. Additionally, a CuZr0.15 alloy was produced as a reference material for previously syn-thesized Cu–Sc alloys. During research, the selection of heat treatment for the produced materials was conducted in order to obtain the highest mechanical–electrical properties ratio. Materials obtained in such a way were next subjected to thermal resistance tests. Parameters of thermal resistance test included temperatures from the range of 200–700 °C and 1 h of anneal-ing time. The research has shown that CuSc0.15 and CuSc0.3 alloys have higher heat resistance after their precipitation hardening compared to the Cu–Zr alloy. The paper also presents microstructural research of the produced materials, which showed that alloying elements precipitates are mainly localized at the grain boundaries of the material structure.

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Analysis of the strengthening and recrystallization of electrolytic copper (Cu-ETP) and oxygen free copper (Cu-OF)

Zasadzińska Małgorzata, Knych Tadeusz, Strzępek Paweł, Jurkiewicz Bartosz, Franczak Krystian

Archives of Civil and Mechanical Engineering

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2019

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Vol. 19, no. 1

186--193

EN

The research paper studies the strengthening and the kinetics of recrystallization of ETP copper and OF copper. This research covers a wide scope of strain hardening specific for the manufacturing of microwires (true strain of the order of 5) and the range of temperatures and times of the recrystallization process referring to the real life conditions occurring in advanced technologies of microwires’ manufacturing. As a result of the performed tests, it was established that the recrystallization temperature of ETP copper is lower than the recrystallization temperature of OF copper regardless of the recrystallization time as the recrystallisation effect can be achieved after about 10–30 s regardless of the copper grade.