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2 International Journal of Microelectronics and Computer Science

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Design Model and Data Management for 3D IC Development

Grunewald W., Hahn K., Bruck R. R.

International Journal of Microelectronics and Computer Science

2012

Vol. 3, nr 3

88-94

The development of 3D systems is a highly complex procedure. Next to a huge variation of possibilities on how to vertically integrate two or more dies, a lot of aspects regarding cost, design and application specific selection of technology have to be considered. Therefore a design model will be presented, that considers the mutual influence of design and process technology during the integration flow development. The design model has been implemented in a software system. To be able to develop integration flows, complex technology information is needed, which results in the necessity of a data management with usage of a technology database.

Distributed and collaborative product engineering for MEMS

Schmidt T., Hahn K., Mielke M., Brück R., Ortloff D., Popp J.

International Journal of Microelectronics and Computer Science

2010

Vol. 1, nr 3

277-286

Small and inexpensive acceleration sensors, cameras, microphones, micro-mirrors, touch-panels and other products of the MNT industry are the core components of almost every new and innovative electronic appliance. Customer-tailored functions and specifications require a deep involvement of the customer throughout the whole value chain. Often the varying stages of the product engineering flow are carried out by diverse companies (or at least different departments) in different locations. With "time to market" being essential, a fast and effective product engineering approach along with comprehensive software support is required. In this paper we introduce a comprehensive methodology and based on that a concept for a distributed environment for customer-oriented product engineering of MEMS products. The development is currently carried out in an international EU research project.