3D printing has recently been experiencing a period of extremely rapid development. This is due to the fact that researchers as well as the industry recognize the many advantages of 3D printing. The dynamic development of this field brings about the advancement of new technologies, leading to the search for new photocurable resin formulations that enable efficient 3D printing in various environments. The development of an appropriate photocurable resin for 3D printing in the aqueous environment of electroplating baths is a crucial aspect in designing new devices for multi-material 3D printing that utilize coupled processes of electrodeposition and photopolymerization. Therefore, this article analyzes the effect of different environments on the kinetics of the photopolymerization process of photo-curable compositions dedicated to 3D printing. The study was carried out in four different environments: argon, water, saturated copper (II) sulfate solution and saturated copper (II) sulfate solution acidified with monomolar sulfuric (VI) acid. The work used techniques such as Fluorescent Probe Technique, photorheology, rheology and Raman spectroscopy to investigate the course of the photopolymerization process. The results of the experiments showed that the environment has a significant effect on the degree of conversion of monomers and on the rate of the photopolymerization process itself.
3D printing has significantly evolved in recent years. Initially, only plastics were used as materials for 3D printing, but technological advancement has enabled 3D printing with materials such as metals, ceramics and biomaterials. With the development of 3D printing, there emerged a need to create a printer for producing hybrid parts, such as metal-plastic, characterized by both the exceptional strength and durability of metal and the lightweight and insulating properties of plastics. The new technique of 3D printing involves layer-by-layer metal growth in the electroplating process, as well as extrusion of a photopolymer composition, followed by UV light curing on the surface of a copper layer. Prints from this new type of 3D printer must exhibit strong adhesive bonding to prevent damage to the printed model. Therefore, mechanical tests were conducted to examine the adhesion of prepared photopolymer compositions to copper sheet coated with electroplated metal and to regular copper sheet in order to compare the obtained values. Analyzing the test results, it can be concluded that the structure of electrodeposited copper significantly improves the adhesive bond strength.
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