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Crystallization of GX2CrNiMoCuN 25-6-3-3 Grade Alloy Cast Steel and its Microstructure in the As-cast State and After Heat Treatment

Wróbel Tomasz, Jurczyk Paweł, Baron Czesław, Nuckowski Paweł M.

Archives of Foundry Engineering

2023

Vol. 23, iss. 3

94--103

The paper presents the results of research conducted in the field of crystallization and microstructure of duplex alloy cast steel GX2CrNiMoCuN 25-6-3-3 grade. The material for research was the above-mentioned cast steel with a chemical composition compliant with the relevant PN-EN 10283 standard, but melted at the lowest standard allowable concentration of alloying additives (some in short supply and expensive), i.e. Cr, Ni, Mn, Mo, Cu and N. The analysis of the crystallization process was performed based on the DTA (Derivative Thermal Analysis) method for a stepped casting with a thickness of individual steps of 10, 20, 40 and 60 mm. The influence of wall thickness was also taken into account in the cast steel microstructure testing, both in the as-cast state and after solution heat treatment. The phase composition of the cast steel microstructure was determined by using an optical microscope and X-ray phase analysis. The analysis of test results shows that the crystallization of tested cast steel uses the ferritic mechanism, while austenite is formed as a result of solid state transformation. The cast steel under analysis in the as-cast state tends to precipitate the undesirable σ-type Fe-Cr intermetallic phase in the microstructure, regardless of its wall thickness. However, the casting wall thickness in the as-cast state affects the austenite grain size, i.e. the thicker the casting wall, the wider the γ phase grains. The above-mentioned defects of the tested duplex alloy cast steel microstructure can be effectively eliminated by subjecting it to heat treatment of type hyperquenching.

Evaluation of the efficiency of metal recovery from printed circuit boards using gravity processes

Franke Dawid M., Suponik Tomasz, Nuckowski Paweł M., Dubaj Justyna

Physicochemical Problems of Mineral Processing

2021

Vol. 57, iss. 4

63--77

This paper evaluates the efficiency of metal recovery from printed circuit boards (PCBs) using two gravity separation devices: a shaking table and a cyclofluid separator. The test results were compared with the results obtained from previous research, where an electrostatic separation process was used for an identically prepared feed. The feed for the separators consisted of PCBs shredded in a knife mill at cryogenic temperatures. The separation efficiency and purity of the products were evaluated based on microscopic analysis, ICP-AES, SEM-EDS, XRD, and specific density. The yield of concentrates (valuable metals) obtained from the shaking table and the cyclofluid separator amounted to 25.7% and 18.9%, respectively. However, the concentrate obtained from the cyclofluid separator was characterised by much higher purity, amounting to ~88% of valuable metals, compared to ~72% for the shaking table. In both cases, middlings formed a significant share, their yield amounting to ~25%, with the share of valuable metals of ~15%. The yield of waste obtained from the shaking table and the cyclofluid separator were 42.6% and 52.5%, respectively. In both cases, as a result of the applied process, the waste was divided into two homogeneous groups differing in grain size and shape. The recovery of metals through gravity separation is possible, in particular, by using a shaking table. These processes can also be applied to separate waste (plastics) into two groups to be selectively processed to produce new materials in line with a circular economy.

Recovery of metals from printed circuit boards by means of electrostatic separation

Franke Dawid, Suponik Tomasz, Nuckowski Paweł M., Gołombek Klaudiusz, Hyra Kamila

Management Systems in Production Engineering

2020

nr 4 (28)

213--219

Without the use of appropriate recycling technologies, the growing amount of electronic waste in the world can be a threat to the development of new technologies, and in the case of improper waste management, may have a negative impact on the environment. This is due to the fact that this waste contains large amounts of valuable metals and toxic polymers. Therefore, it should be recycled in accordance with the assumptions of the circular economy. The methods of mechanical recovery of metals from electronic waste, including printed circuits, may be widely used in the future by waste management companies as well as metal production and processing companies. That is why, a well-known and easily applicable electrostatic separation (ES) method was used to recover metals from printed circuit boards. The grain class of 0.32 - 0.10 mm, obtained after grinding the boards, was fed to a separator. Feed and separation products were analyzed by means of ICP-AES, SEM/EDS and XRD. The concentrate yield obtained after electrostatic separation amounted to 32.3% of the feed. Its density was 11.1 g/cc. Out of the 91.44% elements identified in the concentrate, over 90% were metals. XRD, SEM observations and EDS analysis confirmed the presence of non-metallic materials in the concentrate. This relatively high content of impurities indicates the need to grind printed circuit board into grain classes smaller than 0.32-0.10 mm.