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Mechanism and growth kinetics of Al3Ti phase in fifteen-layered Ti Gr.1/A1050 clads produced with the explosive welding technique

Janusz-Skuza Marta, Bigos Agnieszka, Kwiecień Izabella, Wierzbicka-Miernik Anna, Szulc Zygmunt, Wojewoda-Budka Joanna

Archives of Civil and Mechanical Engineering

2024

Vol. 24, no. 3

art. no. e155, 2024

This study was dedicated to the detailed characterization of the microstructural changes and the phase analysis of the interfaces formed in explosive welding of multilayered Ti Gr.1/A1050 clads. The significant effect of the detonation source localization on the microstructure of the welded materials interfaces after collision, and consequently on the diffusion processes induced by the elevated temperature was showed. Annealing process at 550 °C for series of time intervals of the Ti/Al clad allowed to determine the growth mechanism of the Al3Ti phase formed along particular interfaces. Moreover, the microstructure observations and calculations evidenced different growth mechanisms related to the localization of the Ti/Al interface in respect to the detonation source.

How to suppress the Kirkendall porosity within the Ti/Ni explosive welds?

Wojewoda-Budka Joanna, Kwiecien Izabella, Bigos Agnieszka, Terlicka Sylwia, Litynska-Dobrzynska Lidia, Petrzak Paweł, Wierzbicka-Miernik Anna, Szczerba Maciej, Szulc Zygmunt, Rabkin Eugen

Archives of Civil and Mechanical Engineering

2024

Vol. 24, no. 2

art. no. e117, 2024

Pure Ti (Grade 1) and Ni (type Ni201) were used to produce the Ti/Ni welds employing the explosive welding process. Thermal expansion of the welded plates was determined using dilatometric measurements from room temperature up to 600 °C. The results showed that the thermal expansion coefficient of Ti/Ni welded plates is closer to that of pure nickel than would be suggested by the Timoshenko’s model for bimetallic strip. The microstructure of the Ti/Ni interface after exposure to high temperatures revealed the presence of extensive interface porosity (Kirkendall porosity). This may cause a catastrophic disintegration of the weld during working or essential forming. The welded plates were annealed at the temperature of 650 °C under different applied compressive loads, and the applied load was shown to alter the microstructure of the Nix<.sub>Tiy phases present at the Ti/Ni interface. Based on the obtained interface microstructural data, the strategy to suppress the Kirkendall porosity at the interface was proposed.

Antipathogenic copper coatings: electrodeposition process and microstructure analysis

Bigos Agnieszka, Bugajska Monika, Kwiecień Izabela, Janusz-Skuza Marta, Szczerba Maciej, Ozga Piotr, Wierzbicka-Miernik Anna, Dyner Marcin, Misztela Andrzej, Dyner Aneta, Wojewoda-Budka Joanna

Archives of Civil and Mechanical Engineering

2023

Vol. 23, no. 4

art. e233, s. 1--11

Copper coatings are an important group of decorative-protective materials characterised by high corrosion resistance, excellent thermal and electrical conductivity, which lately gained more significance due to their antimicrobial activity. The main aim of the presented research was to electrodeposit homogenous copper coatings from the non-cyanide electrolyte solution in galvanostatic conditions on steel (1.4024) and nickel (Ni201) substrates, commercially used for surgical instruments. The effect of substrate finishes used in the production line, by shot peening with glass balls, corundum treatment and brushing on the coatings surface formation, was investigated. The substrates’ and coatings’ microstructural properties were analyzed by scanning and transmission electron microscopy, atomic force microscopy, and X-ray diffraction analysis. The current efficiency of the copper reduction on nickel and steel substrates was found to be above 95%. The copper layers adhere to both substrates, except those deposited on a brushed surface. Regardless of the substrate used, they have a nanocrystalline structure with an average crystallite size of 30 nm. Moreover, the coating surface morphology, which affects the nature of interaction with microorganisms, was effectively modified by the appropriate substrate finishing without changing the electrodeposition conditions.