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Development of Crack Detection Method with 2 Dimensionally Generated 3 Dimensionally Reconstructed Images in THT Solder Joints

Gergely G., Koncz-Horváth D., Weltsch Z., Gacsi Z.

Archives of Metallurgy and Materials

2017

Vol. 62, iss. 2B

1033--1038

This work represents an interesting development in the detection and interpretation of crack evolution in through hole technology (THT) solder joints, which based on the development of general and common method. Serial sectioning is a useful method because it overcomes the problems associated with traditional two-dimensional metallographic techniques by providing information about (micro)structures in three-dimensions. In our work, serials sectioning with reconstruction method was utilized to visualize the 3D nature of cracks in through hole solder joint. Accurate quantitive analysis of the cracks, such as crack length, position and extension are presented with a help of the developed method: newly defined parameter and serial-cross sectioning method.

Wetting ability of Ag(Cu, Zn, Ga) alloys on graphite substrate

Weltsch Z., Lovas A., Cziraki A., Tichy G., Toth A. L.

International Journal of Applied Mechanics and Engineering

2010

Vol. 15, no 2

389-395

The temperature dependence of wetting angles (T) of Ag-M based melts (M: Cu, Zn, Ga) on graphite substrates are compared. The slope of (T) is negative, which follows from the Eötvös rule. The difference in the slope arises from the M alloying elements. A texture formation was found in the substrate/drop interphase region after solidification. The enrichment (segregation) of Ag atoms in the interface layer was observed in the Ag-Ga alloy in the solidified structure. The action of the melt temperature was examined also on the degree of texture formation, which seems to be coupled with the magnitude of the contact angle.