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The Investigation of Conductive Via Properties

Jurków D., Dorczyński M., Golonka L.

Metrology and Measurement Systems

2015

Vol. 22, nr 1

39-50

The investigation ofthe Low Temperature Co-fired Ceramic (L TCC) via filling process quality is presented in this paper. The goal of this paper was to propose and to validate a way of the verification whether the L TCC fabrication was conducted correctly. The work presents an application of the Design of the Experiment (DoE) methodology in such validation and discusses usefulness and drawbacks of the chosen solution. The optimized technology of via filling will be applied in the fabrication of tactile displays for blind people.