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Thermal modelling of modern processors using FEM and compact model

Galicia M., Zając P., Maj C., Szermer M., Napieralski A.

International Journal of Microelectronics and Computer Science

2015

Vol. 6, nr 3

110--116

A variety of thermal models has been proposed to predict the temperatures inside modern processors. In this paper, we describe and compare two such approaches, a detailed FEMbased simulation and a simpler architectural compact model. It is shown that both models provide comparable results when it comes to predicting the maximal temperature, however there are also non-negligible differences when estimating thermal gradients within a chip. Furthermore, transient simulation results show some differences in temperature profile during processor heating.