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Heat Treatment Effect on Physical Properties of Stainless Steel / Inconel Bonded by Directed Energy Deposition

Eom Yeong Seong, Kim Kyung Tae, Kim Dong Won, Yu Ji-Hun, Sim Chul Yong, An Seung Jun, Park Yong-Ha, Son Injoon

Archives of Metallurgy and Materials

2021

Vol. 66, iss. 4

1049--1054

In this study, stainless steel 316L and Inconel 625 alloy powders were additively manufactured by using directed energy deposition process. And heat treatment effect on hardness and microstructures of the bonded stainless steel 316L/Inconel 625 sample was investigated. The microstructures shows there are no secondary phases and big inclusions near interfacial region between stainless steel 316L and Inconel 625 except several small cracks. The results of TEM and Vickers Hardness show the interfacial area have a few tens of micrometers in thickness. Interestingly, as the heat treatment temperature increases, the cracks in the stainless steel region does not change in morphology while both hardness values of stainless steel 316L and Inconel 625 decrease. These results can be used for designing pipes and valves with surface treatment of Inconel material based on stainless steel 316L material using the directed energy deposition.

Effect of Pd-P Layer on the Bonding Strength of Bi-Te Thermoelectric Elements

Bae Sung Hwa, Han Se Hun, Son Injoon, Kim Kyung Tae

Archives of Metallurgy and Materials

2019

Vol. 64, iss. 3

963--968

In this study, the effect of electroless Pd-P plating on the bonding strength of the Bi-Te thermoelectric elements was investigated. The bonding strength was approximately doubled by electroless Pd-P plating. Brittle Sn-Te intermetallic compounds were formed on the bonding interface of the thermoelectric elements without electroless Pd-P plating, and the fracture of the bond originated from these intermetallic compounds. A Pd-Sn solder reaction layer with a thickness of approximately 20 μm was formed under the Pd-P plating layer in the case of the electroless Pd-P plating, and prevented the diffusion of Bi and Te. In addition, the fracture did not occur on the bonding interface but in the thermoelectric elements for the electroless Pd-P plating because the bonding strength of the Pd-Sn reaction layer was higher than the shear strength of the thermoelectric elements.