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Uncooled microbolometer detector: recent developments at ULIS

Tissot J. L., Trouilleau C., Fieque B., Crastes A., Legras O.

Opto-Electronics Review

2006

Vol. 14, No. 1

25-32

Uncooled infrared focal plane arrays are being developed for a wide range of thermal imaging applications. Fire-fighting, predictive maintenance, process control and thermography are a few of the industrial applications which could take benefit from uncooled infrared detector. Therefore, to answer these markets, a 35-µm pixel-pitch uncooled IR detector technology has been developed enabling high performance 160x120 and 384x288 arrays production. Besides a wide-band version from uncooled 320x240/45 µm array has been also developed in order to address process control and more precisely industrial furnaces control. The ULIS amorphous silicon technology is well adapted to manufacture low cost detector in mass production. After some brief microbolometer technological background, we present the characterization of 35 µm pixel-pitch detector as well as the wide-band 320x240 infrared focal plane arrays with a pixel pitch of 45 µm.

IR detection with uncooled focal plane arrays. State-of-the art and trends

Tissot J. L.

Opto-Electronics Review

2004

Vol. 12, No. 1

105--109

The emergence of uncooled detectors has opened new opportunities for IR detection for both military and commercial applications. Development of such devices involves a lot of trade-offs between the different parameters that define the technological stack. These trade-offs explain the number of different architectures that are under worldwide development. The key factor is to find a high sensitivity and low noise thermometer material compatible with silicon technology in order to achieve high thermal isolation in the smallest area as possible. Ferroelectric thermometer based on hybrid technology and electrical resistive thermometer based (microbolometer) technology are under development. However, ferroelectric material suffers from the difficulty to achieve a high figure of merit from thin film that is needed for monolithic structure development. Besides, the microbolometer technology, well adapted for thin film process, leads to higher performance at the expense of more complex readout integrated circuit design. LETI and ULIS have been chosen from the very beginning to develop first, a monolithic microbolometer technology fully compatible with commercially available CMOS technology and secondly, amorphous silicon based thermometer. This silicon approach has the greatest potential for reducing infrared detector manufacturing cost. After the development of the technology, the transfer to industrial facilities has been performed in a short period of time and the production is now ramping up with ULIS team in new facilities. LETI and ULIS are now working to facilitate the IRFPA integration into equipment in order to address a very large market. Achievement of this goal needs the development of smart sensors with on-chip advanced functions and the decrease in manufacturing cost of IRFPA by decreasing the pixel pitch and simplifying the vacuum package. We present in this paper the new designs for readout circuit and packages that will be used for 384×288 and 160×120 arrays with a pitch of 35 um and advanced results on 35 žm pixel pitch arrays. Thermographic application needs high stable infrared detector with a precise determination of the amount of absorbed infrared flux. Hence, infrared detector with internal temperature stabilized shield has been developed and characterised. The results will be presented.