Despite recent innovations, metal substrates are still difficult to protect with water-borne products because of their inherent weakness (residual surfactants from polymerization enabling water migration through the film, rust formation during application, lack of adhesion to non ferrous metals, etc.). Nevertheless, because of environmental and legislative pressure, there is an increasing demand for high quality Direct-To-Metal products able to substitute solvent borne technologies such as alkyds. ACT’12 Congress will be the opportunity for OMNOVA Solutions to introduce its new binder, designed for DTM enamel, with the following key advantages: Excellent adhesion to ferrous & non-ferrous metals, high initial gloss and gloss retention, outstanding water resistance and salt spray resistance without anticorrosive pigment.
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