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Content available Characterization of Ceramic Particle Reinforced Titanium Composite Produced Via Powder Metallurgy
Angel D. A., Miko T., Benke M., Gacsi Z.
Archives of Metallurgy and Materials
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2020
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Vol. 65, iss. 2
515--519
EN
Nowadays, titanium is one of the most popular materials for aeronautical applications due to its good corrosion resistance, formability and strength. In this paper, rutile reinforced titanium matrix composites were produced via powder metallurgy. The steps included high energy ball milling of raw titanium and rutile powders in a planetary ball mill, which was followed by cold-pressing and sintering without external pressure. For the characterization of the milled powders and the sintered composites, scanning electron microscope, X-ray diffraction and compressive strength examinations were carried out. The results showed that the rutile has a strengthening effect on the titanium matrix. 1 wt% rutile increased the compressive strength compared to the raw titanium. Increasing the milling time of the metal matrix decreased the compressive strength values.
2
Content available Investigation of Multicomponent Lead-Free Solders
Gyenes A., Benke M., Teglas N., Nagy E., Gacsi Z.
Archives of Metallurgy and Materials
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2017
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Vol. 62, iss. 2B
1071--1074
EN
According to the directives (RoHS and WEEE) adopted by the European Union, lead has been banned from the manufacturing processes because of its health and environmental hazards. Therefore, the development of lead-free solders is one of the most important research areas of the electronic industry. This paper investigates multicomponent Sn-Ag-Cu based lead-free solders with different compositions. The properties of the six-component Innolot (SAC+BiSbNi) and two low-Ag containing alloys were compared with the widespread used SAC307 solder. Microstructure investigations and X-ray diffraction measurements were performed to analyze and identify the formed phases, furthermore, tensile tests and microhardness measurements were executed to determine the mechanical properties of the examined solders.
3
Content available Correlation Between Pin Misalignment and Crack Length in THT Solder Joints
Molnar A., Benke M., Gacsi Z.
Archives of Metallurgy and Materials
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2017
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Vol. 62, iss. 2B
1063--1066
EN
In this manuscript, correlations were searched for between pin misalignments relative to PCB bores and crack propagation after cyclic thermal shock tests in THT solder joints produced from lead-free solder alloys. In total, 7 compositions were examined including SAC solders with varying Ag, Cu and Ni contents. The crack propagation was initiated by cyclic thermal shock tests with 40°C / +125°C temperature profiles. Pin misalignments relative to the bores were characterized with three attributes obtained from one section of the examined solder joints. Cracks typically originated at the solder/pin or solder/bore interfaces and propagated within the solder. It was shown that pin misalignments did not have an effect on crack propagation, thus, the solder joints’ lifetime.
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