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EN
The supplemental energy dissipation system is a practical approach to attenuate the structural response under extreme loading. Viscoelastic damping used to reinforce the structure against the seismic vibration, Viscoelastic material (VEM) most commonly used in viscoelastic dampers (VEDs). In this paper, dynamic mechanical analysis (DMA) approach is used to investigate the performance index of VEM. It is demonstrated that the performance index, such as storage modulus, loss modulus, and loss factor decrease noticeably as the temperature increases, which reflects the low stiffness at high temperature. Excitation frequency also influenced the performance index, and the reaction has correspondence to temperature. As the temperature increases, the VEM dynamic properties decreases, which represents the rubbery region, and it is found that higher to low-temperature dynamic properties increases, which the glassy region is. DMA is a particularly flexible approach, and it characterizes the properties of VEM simultaneously at various conditions.
EN
Retrofit and structural design with vibration control devices have been proven repeatedly to be feasible seismic hazard mitigation approach. To control the structural response; supplemental energy dissipation devices have been most commonly used for energy absorption. The passive control system has been successfully incorporated in mid to high rise buildings as an appropriate energy absorbing system to suppress seismic and wind-induced excitation. The considerable theses that are highlighted include vibration control devices, the dynamic behavior of devices; energy dissipation mechanism, devices installation approach and building guidelines for structural analysis and design employing vibration control devices also, design concern that is specific to building with vibration control devices. The following four types of supplemental damping devices have been investigated in this review: metallic devices, friction devices, viscous fluid devices, and viscoelastic devices. Although numerous devices installation techniques available, more precisely, devices installation approaches have been reviewed in this paper, including Analysis and Redesign approach (Lavan A/R), standard placement approach, simplified sequential search algorithm, and Takewaki approach.
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