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Change of aluminum alloys structure by sono-solidification

Gnapowski S., Tsunekawa Y., Okumiya M., Lenik K.

Archives of Foundry Engineering

2013

Vol. 13, iss. 4

39--42

This experiment utilized five Aluminum alloys with silicon content percentages of 7, 10, 12.6, 14.5 and 17(wt)%. Ultrasonic vibration was applied to improved the quality of aluminum alloys. Sono-solidification, in which ultrasound vibrations are applied to molten metal during its solidification, is expected to cause improved mechanical properties due to grain refinement. Observed by microstructure photographs was that grains became smaller and their shapes more regular. Using ultra sound solidification α Al appeared during ultrasound treatment the eutectic solidification time was longest around 10% compared with same condition experiment without ultrasound treatment.

ACdTe X-ray imaging device using vertical thin film field emitter array

Tsunekawa Y., Nakagawa N., Neo Y., Morii H., Aokia T., Mimura H., Nagao M., Yoshidab T., Kanemaru S.

Journal of Automation Mobile Robotics and Intelligent Systems

2009

Vol. 3, No. 4

137-139

We have demonstrated the novel CdTe X-ray imaging device that consists of a Schottky CdTe diode and a Vertical Thin Film Field Emitter Array (VTF-FEA). The Schottky CdTe diode was fabricated by deposied indium (In) thin film on a Cl-doped p-type (p-type) CdTe substrate and Sb2S3 on the opposite side of the CdTe substrate. VTF-FEA was fabricated by ion induced bending (IIB) and etch-back method. The signal current was successfully detected by the recombination of the stored on the surface holes with the emitted electrons from FEA, and it was clarified that it depended on the X-ray intensity. And the imaging device succeeded in obtaining the Cu plate transmission image.