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Surface forces in chemical mechanical planarization and semiconductor wafer cleaning systems

Hupka Lukasz, Nalaskowski Jakub, Miller Jan D., Hupka Jan

Wiadomości Chemiczne

2021

[Z] 75, 9-10

1229--1240

Superior uniformity and local planarity of semiconductor wafers in the chemical mechanical planarization (CMP) process as well as efficient post-CMP cleaning is controlled by surface chemistry phenomena. The AFM colloidal probe technique was used to demonstrate surface forces which are of special significance to CMP and post-CMP cleaning. Examples of ways to manipulate those interactions are provided, and the benefits to CMP processes and post-CMP cleaning are discussed.