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1 Annals of Warsaw University of Life Sciences - SGGW. Forestry and Wood Technology

1 2012

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Modelling the mechanical stresses in adhesive joints of wood bondings

Hering Stefan, Niemz Peter

Annals of Warsaw University of Life Sciences - SGGW. Forestry and Wood Technology

2012

No. 78

60--75

Modelling the mechanical stresses in adhesive joints of wood bondings. Wood bondings have been used in timber construction and many other applications for a long time. Using layered arrangements, the homogenisation of the anisotropic physical and mechanical properties of solid wood reduce the influence of moisture and improve the mechanical behaviour of structural elements. However, new weak points can be created and effects such as debonding and delamination can occur. These failure characteristics depend on mechanical and hygroscopic loading as well as the composition of the structural components. Hence, delamination can be reduced by adjusting the properties of the appropriate adherend or by changing the structural assembly of the specific elements. Using finite element analysis, the influence of the adherend properties during the testing procedure and an example of cross-laminated wood panels on the adhesive load are investigated. The results show significant differences in the glue line stress distribution for varied growth ring angle, longitudinal Young’s modulus, diffusion as well as swelling and shrinkage properties.