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1 2008

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The numerical analysis of Hi-temp 095 wire drawing process

Wiewiórowska S., Muskalski M., Suliga M., Pełka M.

Journal of Achievements in Materials and Manufacturing Engineering

2008

Vol. 27, nr 2

175-178

Purpose: The aim of this paper was the optimization of wire drawing process parameters. Design/methodology/approach: The hard binding material determined according to American standard ANSI/AWSA 5.8-92 as High-temp 095 was chosen to the analysis of wire drawing process. It is hard solder with high fluidity properties. Findings: Wires, bars and strips are the most often use forms of this solder on the base of copper with low deformability properties, which shows crack sensitivity during cold plastic working processes so there was the necessity to determining optimal parameters of initial material use to the later cold plastic working processes. Research limitations/implications: To the numerical analysis of Hi-temp 095 wire drawing process the Drawing 2d programme based of finite element method, has been use, for initial materials obtained on the casting and extrusion way. Practical implications: The optimal properties of basic material use for further plastic working processes were determined. Originality/value: The rheology of materials after casting and extrusion processes were determined.