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Adsorption Behaviour of Laprol 2402 C on Copper Electrode

Survila A., Mockus Z., Kanapeckaite S., Samulevičiene M.

Polish Journal of Chemistry

2002

Vol. 76 / nr 7

983-991

Voltammetry and EIS were applied to study the adsorption behaviour of laprol 2402 C (the copolymer of ethene and propene oxides) on a Cu electrode in strongly acidic Cu(II) sulphate solutions. Analysis of impedance data was carried out on the basis of adequate equivalent circuits, containing electric analogues of the electrochemical system. The results indicate that laprol displays a rather weak surface activity on copper in chloride-free solutions. Pronounced inhibition of Cu(II) reduction takes place, when micromolar amounts of chloride are added. A more compact surface layer involving Cl- ions is thought to be formed under these conditions.

Tin(II) Oxidation by Oxygen and Formation of Sn(IV)–Sn(II) Colloid

Rozovskis G., Pautieniene V., Mockus Z.

Polish Journal of Chemistry

2000

Vol. 74, nr 12

1665-1674

Sn(IV) compounds, formed by a slow oxidation of Sn(II) by air in HCl or H2SO4 solutions, take part in formation of non-stable colloid particles, which coagulate rather quickly. Introduction of additional amount of Sn(IV) to the solutions of Sn(II) in HCl or H2SO4 or formation of Sn(IV) during high-rate catalytic oxidation of Sn(II) by oxygen results in formation of yellow-coloured stable colloid solutions. The colloid particles formed in HCl solution are charged positively, while formed in H2SO4 solution they are charged negatively. Sn(IV)–Sn(II) colloid particles act as an inhibitor of the process of Sn(II) oxidation by oxygen in both HCl and H2SO4 solutions. However, the colloid particles do not change the rate of Sn(II) oxidation in the H2SO4 solution with addition of Cu(II), catalyzing this reaction.