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EN
Millimeter-wave (mm-wave) transmitters are often fabricated using advanced technology and require a sophisticated manufacturing facility. Access to such technologies is often very limited and difficult to gain particularly at the initial stage of research. Therefore, to increase the accessibility of mm-wave transmitters, this study proposes a design that can be assembled in a standard microwave laboratory from commercially available or externally ordered components. The transmitter demonstrated in this paper operates above 100 GHz and is based on a lowtemperature co-fired ceramic board in which the antenna array, microstrip lines, and power-supply lines are fabricated in a single process. Different technologies are used to assemble the module, e.g., wire-bonding, soldering, and wax adhesion. Advantages and disadvantages of the proposed design are given based on experimental evaluation of the prototype. Although the performance of the developed transmitter is not as good as that of the similar modules available in the recent literature, the results confirm the feasibility of a mm-wave transmitter that is assembled without employing advanced technologies and superior machinery.
2
Content available Digital communication : optical vs. THz links
EN
The paper presents a comprehensive look at the perspectives on the use of THz in digital communication systems. The publication aims to focus on arguments that justify a significant increase in the frequency of radio links and their integration with fibre-based networks. Comparison of THz links with their microwave and optical counterparts is discussed from basic physical limitations to technological constraints. Main attention is paid to the available channel capacity resulting from its bandwidth and signal-to-noise ratio. The short final discussion is about technology platforms that seem to be crucial to the availability of suitable THz sources. According to the author, the biggest advantage of using bands in the range of several hundred GHz for a digital data transmission is their use for mobile communication over short distances, as well as for broadband indoor links. However, these applications require a development of compact electronic THz sources with low noise and power reaching single watts. This is beyond the range of the most popular silicon-based technology platform, although a significant progress can be expected with the development of technologies based on wide bandgap semiconductors. Fibre optic connections remain the unquestioned leader in communication over long distances and permanent links.
3
Content available remote Measurements of the responsivity of FET‐based detectors of sub‐THz radiation
EN
This article describes a novel approach to measure responsivity of a FET-based sub-THz detector using on-wafer probes to directly feed a bare antenna-less detecting device. Thus, the approach eliminates the need to know beforehand the detector’s effective aperture, which can be a source of large variation between responsivity measurements of various FET-based detectors often cited in the literature. It seems that the presented method can be useful at making direct comparisons between responsivity of various devices (e.g., MOSFETs, HEMTs etc.). As a demonstration, the sub-THz responsivity of a pHEMT device fabricated using a commercial GaAs process has been measured in a WR-3 frequency band. Additionally, the results have been compared against data obtained using an alternative approach. The verification method consisted in integrating exactly the same device with a broad-band antenna and a carefully selected high-resistivity silicon lens and comparing its performance with that of a commercial calibrated detector based on Schottky diodes.
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