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2 Selected Engineering Problems

2 2015

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The statistical control of the measuring process capability of vertical displacement of the head restraint - The first part: Theory

Paprocka I., Dzięgiel A.

Selected Engineering Problems

2015

nr 6

63--70

In this paper, various techniques of the statistical process control (SPT) are presented namely: histogram, control cards, machine capability and process capability. The histogram is used to make sure that the process is statistically stable. The control cards are used to determine whether a current deviation from the norm is caused by a random or specific action. The control cards enable to indicate the process which is deregulated. In the paper, the guidelines of the application of the process capability indicator to determine whether the process is able to meet the quality requirements imposed by a customer are presented. The guidelines of the application of the machine capability indicator to indicate whether a task allocated to a machine is executed with a sufficient accuracy at the specified time are presented.

The statistical control of the measuring process capability of vertical displacement of the head restraint - The second part: Case study

Paprocka I., Dzięgiel A.

Selected Engineering Problems

2015

nr 6

71--76

In the paper, two techniques of the statistical process control, namely: histogram and process capability are applied to examine whether a process is statistically controllable and to identify disturbances that occur in the process. The objective is to evaluate the capability of the measuring process of vertical displacement of the head restraint. In the measuring process, forces that are used to displace the head restraint up and down are recorded. The analysis consists of checking whether the lifting and lowering forces of the head restraint belong to the required ranges of forces. The processes of displacement of the head restraint up and down are characterised by a high potential, but a poor centering. In order to improve the centering of the process, causes of defects are identified.