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2 Journal of Applied Mathematics and Computational Mechanics

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Thermomechanical responses of functionally graded cylinders

Eker Mehmet, Yarımpabuç Durmuş

Journal of Applied Mathematics and Computational Mechanics

2021

Vol. 20, nr 4

19--28

In this study, thermal and mechanical stresses in hollow thick-walled functionally graded (FG) cylinders is presented under the convection boundary condition. The convective external condition and constant internal temperature in hollow cylinders are investigated. Inhomogeneous material properties produce irregular and two-point linear boundary value problems that are solved numerically by the pseudospectral Chebyshev method. The displacement and thermal stress distributions are examined for two different material couples under particular boundary conditions that are similar to their real engineering applications.Results have demonstrated that the pseudospectral Chebyshev method has low computation costs, high accuracy and ease of implementation and can be easily customized to such engineering problems.

Elastic solutions based on the Mori-Tanaka scheme for pressurized functionally graded cylinder

Eker Mehmet, Yarımpabuç Durmu, Yıldırım Ali, Çelebi Kerimcan

Journal of Applied Mathematics and Computational Mechanics

2020

Vol. 19, nr 4

57--68

In this paper, an elastic analysis of a thick-walled functionally graded cylinder subjected to internal pressure is examined. Material properties for the isotropic material are estimated to obey the Mori-Tanaka homogenization scheme through the thickness. The resulting two-point irregular boundary value problem is solved by the pseudospectral Chebyshev method that converts the boundary value problem to the system of equations, which can be solved by any appropriate decomposition method. Benchmark solutions are used to validate the method. The effect of the arbitrarily chosen volume fraction index is demonstrated for stress and displacement distributions. The effective stresses for different inner radius and volume fraction index are also discussed.