The effect of heat treatment at 903 K on microstructure and intermetallic compound growth in explosively welded A1050/Ti gr. 2/A1050 clad was presented in the paper. Growth kinetics of TiAl3 intermetallic layers formed at upper and lower interfaces of three-layered A1050/Ti gr. 2/A1050 was investigated. A new approach to definition of growth kinetics of TiAl3 intermetallic phase was discussed. It was established that the growth was solely governed by grain boundary diffusion at the upper interface. Change of the mechanism from grain boundary diffusion to volume diffusion was observed at the lower interface.
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