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Zastosowanie logicznych drzew decyzyjnych do analizy wad w etapie lutowania na fali podczas montażu SMT

Sadowińska M.

Zarządzanie Przedsiębiorstwem

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2014

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Vol. 17, nr 2

26--33

EN

Decision trees are a logical method, which graphically presents the solution of logical function. They consist of the branch on which the data are coded variables. Solutions are presented as the true path. The method used to optimize the solution functions are logical decision trees, the construction of which the principle is the same as the logical trees. They make it possible to eliminate the occurrence of twigs isolated and cut off the full beam. This procedure allows to minimize the real twigs. This is advantageous due to the phenomenon that the optimal solution is the combination of variables, which is associated with the tree having the smallest number of real branches. This tree defines the status of the variables tested from most to least important. The purpose of the study was to determine the hierarchy of defects affecting the destabilization of one of the stages of the process SMT (surface mount), which is the wave soldering, and by this determine which should be eliminated in the first place. A tool that has been used for this purpose was a logical decision trees. According to the results of the analysis in the first place should prevent the causes of the formation of solder bridges (machine failure), then-without regard to the order-of overheating the PCB and too low solder temperature (the same effects on the occurrence of errors), which are the result of poor machine settings and the occurrence of machine failure. Thanks to the possibility of using minimization of logical variables (cutting off the full beam) in practical terms, the elimination of identified defects, it is necessary to determine the corrective action regarding the causes of defects, namely the lack of solder. This approach meant that the error should not be the subject of corrective action performed. The indicating reason was responsible only for the occurrence of the lack of solder. The using of logical decision trees could help identify priorities for improvements to the wave soldering realized as part of a process of SMT assembly.

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Próby lutowania bezołowiowego w warunkach produkcyjnych : podsumowanie doświadczeń

Hackiewicz H.

Elektronika : konstrukcje, technologie, zastosowania

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2005

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Vol. 46, nr 12

42-44

PL

Począwszy od lipca 2006 r. producenci zespołów na płytkach drukowanych będą zobowiązani do wyeliminowania ołowiu z montażu elektronicznego. W prezentowanym artykule podsumowano aspekty technologiczne oraz wyniki prób technologicznych dotyczących bezołowiowego lutowania rozpływowego i bezołowiowego lutowania na podwójnej fali w warunkach produkcyjnych.

EN

From July 2006 manufacturers of PCB assemblies have to exclude lead from electronic assembly. In the present article there have been recapitulated technological aspects and results of some experiments relating to lead free reflow soldering and lead free wave soldering in mass production.

3

Adaptacja agregatu lutowniczego do bezołowiowej technologii lutowania na fali lutowia i badania topników wodnych

Sitek J.

Elektronika : konstrukcje, technologie, zastosowania

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2005

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Vol. 46, nr 12

55-57

PL

Z dniem 1 lipca 2006 producenci sprzętu elektronicznego i elektrycznego muszą dostarczać na rynek produkty pozbawione substancji niebezpiecznych wymienionych w dyrektywie UE RoHS. Wymaga to zmiany stosowanych dotychczas materiałów oraz dostosowania technologii lutowania do nowych warunków. Przedstawiono informacje związane z implementacją technologii bezołowiowej do procesu lutowania na fali. Ukazano proces modernizacji agregatu lutowniczego oraz wyniki testów produkcyjnych przeprowadzone z użyciem topników wodnych rekomendowanych dla tej technologii.

EN

From 1 st July 2006 the PCB assembly producers must exclude lead and other dangerous materials from technology process according to RoHS EC Directive. The introduction of lead-free technology require therefore use new solder alloys and fluxes as well as necessity of examine all machine settings used in soldering processes. The article shows information connected with implementation of lead-free technology to wave soldering process. The modernization of wave soldering unit and assessment of VOC-free fluxes, which are recommend for lead-free technology, were presented in details.