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Electrochemical synthesis and structural properties of Cu/Ni multilayers

Tokarz A.

Polish Journal of Applied Chemistry

2005

Vol. 49, nr 4

283-289

Multilayers of Cu/Ni were electodeposited on monocrystalline Si (100) and polycrystalline copper foil substrates using a single bath containing nickel sulphamate, copper sulphate and boric acid. Voltammetric studies allow establishing the suitable potentials for Cu pure and Ni rich single layer. Based on these studies lower activity of silicon than cooper substrate was stated. SEM investigations confirm periodical structure of the prepared multilayers when the Λ period exceeds 50 nm. For lower bilayer thickness XRD method allowed determining Λ value after precise establishing diffraction lines S±i and ML. XRD investigations show that all deposited multilayers exhibited [100] texturing.

Electrical properties and transmission electron microscopy study on sputtered Cu/Ni multilayer films.

Worek C., Jankowski H., Ciura F.

Inżynieria Materiałowa

1998

R. XIX, nr 4

840-843

Electrical properties as well as the structure and morphology of multilayered Cu/Ni films deposited by magnetron sputtering were investigated. The influence of the deposition and annealing parameters on the temperature coefficient of resistance (TCR) and sample resistivity were determined. Using TEM images the dependence of the grain size of crystalline films on the sublayer Cu and Ni thickness and annealing temperature was investigated.